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MJSU-10PL83 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists ITT Cannon, LLC. Its product description is CONN HEADER VERT 10POS. Review the specifications below when checking this part for your BOM.
The MJSU-10PL83 is a vertical header connector from the ITT Cannon MJS series, designed for through-hole mounting. It features 10 positions with male pin contacts and a 0.050-inch (1.27mm) pitch. The component supports a current rating of 3A and a voltage rating of 400V. Insulation color is natural. Operating temperature range spans from -55°C to 125°C. Moisture sensitivity level is not applicable.
Verify that the specific suffix '83' corresponds to the intended contact plating and insulation material specifications required by your design. Confirm that the vertical header form factor aligns with your PCB layout constraints. Ensure compatibility with the 0.050-inch pitch mating connectors within the MJS family. Check for any specific environmental certifications if operating in extreme conditions.
Select this part when a vertical, through-hole male header is required for the MJS microminiature system. The 10-position count fits compact designs where space is limited but signal integrity is critical. Consider the 3A current rating for power distribution needs. The natural insulation color may be relevant for visual identification or aesthetic requirements in the final assembly.
This component belongs to the MJS (Microminiature D-Sub) series, which offers higher density than traditional rectangular connectors. The MJSU variant specifically denotes a vertical header style. ITT Cannon engineers these connectors for markets including defense, aerospace, and industrial sectors, emphasizing durability against shock and vibration while maintaining a small form factor.
Cross-reference with other MJS series headers such as MJSU-10PS for potential mechanical or plating variations. Verify that alternative parts maintain the same 10-position count and 0.050-inch pitch to ensure mating compatibility without redesigning the PCB footprint.
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