ML6420CS3

Overview

The ML6420CS3 is a standard static random-access memory (SRAM) integrated circuit manufactured by Fairchild Semiconductor. It features a memory organization of 256 words by 4 bits, resulting in a total memory density of 1024 bits. The device operates asynchronously with a maximum access time of 350 nanoseconds. It utilizes three-state outputs for data handling and is housed in a ceramic dual in-line package (CDIP) with 22 terminals. The component is rated for an operating temperature range from -55°C to +85°C and is classified as non-RoHS compliant.

Feature Summary

• Asynchronous operation mode for flexible system integration
• Three-state output capability for bus sharing applications
• Ceramic dual in-line packaging for robust physical protection

Applications

• Industrial control systems requiring reliable temporary data storage
• Embedded systems within harsh environmental conditions
• Legacy hardware maintenance and replacement scenarios

Procurement Notes

Verify RoHS compliance status prior to procurement, as this specific part number is listed as non-compliant. Confirm the ceramic DIP-22 package availability matches the target board design requirements. Ensure the supplier provides authentic Fairchild Semiconductor components to guarantee performance specifications are met. Check for any end-of-life notices or obsolescence warnings before finalizing purchase orders.

Selection Notes

Select this component when a small capacity SRAM with asynchronous interface is required for industrial-grade temperature ranges. The CDIP22 package necessitates through-hole mounting capabilities on the printed circuit board. Consider the 350ns access speed against system timing constraints. Verify that the 4-bit word width aligns with the data bus architecture of the host microcontroller or processor.

Part Context

This SRAM belongs to the standard memory category produced by Fairchild Semiconductor. It serves as a volatile memory solution for storing intermediate data in digital circuits. The device represents a legacy component type often found in older industrial and military electronics designs where high-density modern packages were not utilized.

Replacement Considerations

Direct pin-to-pin replacements must match the 256x4 organization, 350ns speed, and CDIP22 package. Verify compatibility with existing logic levels and power supply requirements. Cross-reference with other manufacturers offering equivalent asynchronous SRAMs in ceramic DIP packages.