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Product Detailed Parameters
- Description：RF FILTER LOWPASS 2.45GHZ 6WFBGA
- Series：MLPF
- Mfr：STMicroelectronics
- Package：Tape & Reel (TR),Cut Tape (CT)
- Frequency：2.45GHz Center
- Bandwidth：100MHz
- Filter Type：Low Pass
- Ripple：-
- Insertion Loss：1.2dB
- Mounting Type：Surface Mount
- Package / Case：6-WFBGA, CSPBGA
- Size / Dimension：0.039" L x 0.063" W (1.00mm x 1.60mm)
- Height (Max)：0.027" (0.68mm)
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Overview
The MLPF-WB-02D3 is a passive integrated device designed for STM32WB5x and STM32WB1x microcontrollers. It integrates an impedance matching network and a deep harmonic suppression filter to enhance RF performance. The component operates at 2.4 GHz with a nominal antenna-side impedance of 50 Ω. It utilizes IPD technology on a high-resistivity substrate, featuring a non-conductive glass layer. The package is available in WLCSP and UFBGA formats, with a thickness of ≤ 630 μm after reflow.
Feature Summary
- Integrates impedance matching specifically tuned for STM32WB5x and STM32WB1x microcontrollers in WLCSP and UFBGA packages.
- Provides deep harmonic suppression filtering to ensure signal integrity.
- Utilizes IPD technology with a non-conductive glass layer to optimize RF performance.
- Offers low insertion loss and reduced RF BOM and board area.
Applications
- Bluetooth Low Energy (BLE) connectivity modules
- Zigbee and Thread networking devices
- Sub-1 GHz radio applications requiring 2.4 GHz harmonic control
- IoT sensor nodes using STM32WB series MCUs
Procurement Notes
Verify the specific package variant (WLCSP or UFBGA) required for your STM32WB5x or STM32WB1x design before ordering. Confirm that the PCB layout strictly follows AN6335 guidelines to maintain the specified 50 Ω impedance and thermal characteristics. Ensure compatibility with ECOPACK2 environmental standards if applicable to your region's regulatory requirements.
Selection Notes
Select this component when designing with STM32WB5x or STM32WB1x MCUs in WLCSP or UFBGA packages to simplify the RF front-end. It replaces discrete matching networks and LC filters, reducing component count and board space. Choose this part if minimizing insertion loss and achieving deep harmonic suppression are critical for meeting regulatory emissions standards in the 2.4 GHz ISM band.
Part Context
This device belongs to STMicroelectronics' MLPF product line, which offers integrated passive devices for wireless MCU integration. These components are designed to replace discrete RF solutions, offering higher reliability and lower profile compared to LTCC or分立器件 alternatives. The MLPF-WB series specifically targets the Bluetooth, Zigbee, and Thread markets supported by the STM32WB family.
Replacement Considerations
MLPF-WB55-02E3 is documented as a companion chip for STM32WB55VX. Verify package compatibility and specific MCU model support before substituting, as impedance matching may differ between WB5x and WB1x variants.
FAQ
What is the maximum thickness of the MLPF-WB-02D3 after assembly?
The device has a thin design with a thickness of ≤ 630 μm after reflow soldering.
Which STM32 microcontroller families does this filter support?
It is matched for STM32WB5x and STM32WB1x microcontrollers.
What packaging options are available for this component?
The MLPF-WB-02D3 is available in WLCSP and UFBGA packages.
