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MM74HCT08MTCX is listed in the Inverter Gates range at ChipApex. The manufacturer field lists onsemi. Its product description is IC GATE AND 4CH 2-INP 14TSSOP. Review the specifications below when checking this part for your BOM.
The MM74HCT08MTCX is a quad 2-input AND gate manufactured by onsemi, belonging to the 74HCT logic series. It operates within a supply voltage range of 4.5 V to 5.5 V and features four independent gates with eight inputs and four outputs. The device utilizes a TSSOP-14 surface-mount package and supports SMD/SMT installation. Electrical characteristics include a propagation delay of 11 ns, with low-level output current of 4.8 mA and high-level output current of -4.8 mA. It functions reliably across an operating temperature range from -55 °C to +125 °C.
Verify the specific suffix 'X' indicates tape-and-reel packaging configuration distinct from tube variants. Confirm RoHS compliance status via official documentation before integration. Ensure the TSSOP-14 footprint matches the target PCB layout dimensions precisely. Validate that the 4.5V to 5.5V supply requirement aligns with the system power architecture.
Select this component when four independent AND gates are required within a compact surface-mount form factor. The HCT series ensures compatibility with existing TTL-based designs while offering CMOS advantages. Consider the 11 ns propagation delay for timing constraints in the application. Verify that the extended temperature range meets the environmental requirements of the deployment scenario.
This part belongs to the MM74HCT08 family of single-function logic gates produced by onsemi. It shares the same internal logic structure as other manufacturers' 74HCT08 equivalents but adheres to onsemi's specific manufacturing specifications and pinout configurations. The device represents a standard solution for basic digital logic implementation in mixed-signal environments.
Cross-reference with other 74HCT08 devices from different vendors ensuring identical pinouts and electrical parameters. Verify that alternative packages match the physical mounting requirements. Confirm functional equivalence regarding propagation delay and output drive capabilities.
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