Application Specific Microcontrollers MM912F634DV2AER2 product image

MM912F634DV2AER2

$3.07
  • Description:IC MCU DUAL LS/HS SWITCH 48LQFP
  • Series:-

SKU:1b7adc2f9095 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MM912F634DV2AER2 is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MCU DUAL LS/HS SWITCH 48LQFP. Review the specifications below when checking this part for your BOM.

Application Specific Microcontrollers specifications for MM912F634DV2AER2

  • Description:IC MCU DUAL LS/HS SWITCH 48LQFP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:-
  • Core Processor:S12
  • Program Memory Type:FLASH (32KB)
  • Controller Series:HCS12
  • RAM Size:2K x 8
  • Interface:LIN, SCI
  • Number of I/O:9
  • Voltage - Supply:2.25V ~ 5.5V
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:-

Application Specific Microcontrollers datasheet and documents for MM912F634DV2AER2

MM912F634DV2AER2

Application Specific Microcontrollers Overview

The MM912F634DV2AER2 is an integrated single-package solution combining an HCS12 microcontroller with a SMARTMOS analog control IC. It features a 16-bit S12 CPU with 32 kByte FLASH and 2.0 kByte RAM, operating at a maximum bus frequency of 20 MHz. The device includes a LIN 2.1 physical layer interface, six high-voltage wake-up inputs (L0–L5), two protected low-side outputs for inductive loads, and two protected high-side outputs. Analog capabilities include a 10-bit 15-channel ADC, current sense module, and Hall sensor supply. It is housed in a 48-pin LQFP package with an exposed pad (AE suffix) and operates within a temperature range of -40°C to 105°C.

Application Specific Microcontrollers Feature Summary

  • Integrated HCS12 MCU with 32 kB Flash, 2 kB RAM, and 20 MHz max bus frequency
  • LIN 2.1 physical layer interface with integrated SCI transceiver
  • Six high-voltage/wake-up inputs (L0-L5) and two low-side/high-side drivers
  • 10-bit 15-channel ADC, current sense module, and Hall sensor supply output

Application Specific Microcontrollers Applications

  • Relay driver applications requiring LIN communication
  • Automotive systems utilizing high-voltage input sensing
  • Inductive load control with current monitoring

Application Specific Microcontrollers Procurement Notes

Verify the 'R2' suffix indicates tape and reel packaging as specified in the ordering information table. Confirm the 'AE' suffix corresponds to the 48-pin LQFP with exposed pad. Ensure the analog option matches Option 2, which lacks the current sense module and reduces wake-up inputs to L0-L3. Cross-reference the part number against the official Freescale/NXP datasheet revision 9.0 for accurate specifications.

Application Specific Microcontrollers Selection Notes

Select this variant when Option 2 analog configuration is required, specifically if the current sense module is not needed. Note that Option 2 limits high-voltage wake-up inputs to L0 through L3, whereas Option 1 supports L0 through L5. The R2 suffix denotes tape and reel delivery. Ensure the design accommodates the 48-pin LQFP-EP package dimensions and thermal requirements for the exposed pad connection.

Application Specific Microcontrollers Part Context

This component belongs to the MM912F634 family of integrated relay drivers. The base model integrates an HCS12 core with SMARTMOS technology. Variants differ by analog options (Option 1 vs. 2), package type (Exposed Pad AE vs. Non-exposed AP), and delivery method (Tray vs. Tape & Reel R2). The DV2 designation specifies the Option 2 analog configuration.

Application Specific Microcontrollers Replacement Considerations

MM912F634DV2AE: Identical electrical specifications but packaged in trays instead of tape and reel.

Application Specific Microcontrollers FAQ

What is the difference between Analog Option 1 and Option 2?

Option 1 includes a current sense module and six wake-up inputs (L0-L5). Option 2 omits the current sense module and provides only four wake-up inputs (L0-L3).

What does the 'R2' suffix indicate?

The 'R2' suffix indicates that the device is supplied in tape and reel packaging.

How are the digital grounds connected internally?

DGND, LGND, and AGND are internally connected to PGND via back-to-back diodes.

MM912F634DV2AER2MM912F634DV2AER2
$3.07
Buy Now