MM912F634DV2AP

Application Specific Microcontrollers Overview

The MM912F634DV2AP is a single-package integrated solution combining an HCS12 microcontroller with a SMARTMOS analog control IC. It features a 16-bit S12 CPU with 32 kB FLASH and 2.0 kB RAM, operating at a maximum bus frequency of 16 MHz. The device includes a LIN 2.1 physical layer interface with integrated SCI, six high-voltage wake-up inputs (L0–L5), two protected low-side outputs for inductive loads, and two protected high-side outputs. Analog capabilities include a 10-bit 15-channel ADC, current sense module, and reverse battery protected voltage sense. It operates within a temperature range of -40°C to 105°C.

Application Specific Microcontrollers Feature Summary

• Integrated HCS12 MCU with 32 kB Flash, 2.0 kB RAM, and 16 MHz max bus frequency
• LIN 2.1 physical layer interface with integrated Serial Communication Interface (SCI)
• Six high-voltage/wake-up inputs (L0-L5) and three low-voltage GPIOs (PTB0-PTB2)
• Two protected low-side drivers and two protected high-side drivers for load control

Application Specific Microcontrollers Applications

• Automotive door, window lifters, and seat control modules
• Local Interconnect Network (LIN) node implementations
• Relay driver circuits requiring integrated power management

Application Specific Microcontrollers Procurement Notes

Verify the specific analog option configuration required for the application. The DV2 suffix indicates Analog Option 2, which lacks the current sense module and limits high-voltage wake-up inputs to L0 through L3. Confirm package type AP corresponds to the non-exposed pad variant suitable for the target PCB layout.

Application Specific Microcontrollers Selection Notes

Select this part when a combined MCU and power driver solution is needed for automotive body applications. Ensure the design does not require the current sense module or all six high-voltage wake-up inputs, as these are excluded in the DV2 derivative. Verify that the 16 MHz clock speed meets the processing requirements for the LIN stack and control logic.

Application Specific Microcontrollers Part Context

This component belongs to the MM912F634 series from Freescale Semiconductor (now NXP). It utilizes a Die-to-Die Interface (D2D) to connect the MCU die with the analog SMARTMOS die, allowing transparent memory mapping. The DV2AP designation specifies the -40°C to 105°C temperature range, Analog Option 2, and the 48-pin LQFP package without an exposed thermal pad.

Application Specific Microcontrollers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.