Microphones MMICT3903-00-012 product image

MMICT3903-00-012

  • Description:MIC MEMS DIGITAL PDM OMNI -37DB
  • Series:T3903
  • Mfr:TDK InvenSense
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:cf1729155247 Category: Brand:

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MMICT3903-00-012 is listed in the Microphones range at ChipApex. The manufacturer field lists TDK InvenSense. Its product description is MIC MEMS DIGITAL PDM OMNI -37DB. Review the specifications below when checking this part for your BOM.

Microphones specifications for MMICT3903-00-012

  • Description:MIC MEMS DIGITAL PDM OMNI -37DB
  • Series:T3903
  • Mfr:TDK InvenSense
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Type:MEMS (Silicon)
  • Output Type:Digital, PDM
  • Direction:Omnidirectional
  • Frequency Range:-
  • Sensitivity:-37dB ±1dB @ 94dB SPL
  • S/N Ratio:66dB
  • Impedance:-
  • Voltage Range:1.65 V ~ 3.63 V
  • Current - Supply:590 µA
  • Port Location:Bottom
  • Ratings:-
  • Termination:Surface Mount
  • Size / Dimension:0.138" L x 0.104" W (3.50mm x 2.65mm)
  • Height (Max):0.039" (0.98mm)
  • Shape:Rectangular
  • Grade:-
  • Qualification:-
  • Voltage - Rated:1.8 V

Microphones datasheet and documents for MMICT3903-00-012

MMICT3903-00-012

Microphones Overview

The MMICT3903-00-012 is a bottom-port MEMS microphone featuring PDM digital output and multi-mode capabilities. It operates at a supply voltage of 1.8 V with a current consumption of 590 uA. The device provides a sensitivity of -37 dB and an SNR of 66 dBA. It supports a frequency range from 27 Hz to 20 kHz and functions within a temperature range of -40 C to +85 C. The component utilizes a surface-mount LGA-5 package measuring 3.5 mm in length, 2.65 mm in width, and 0.98 mm in depth.

Microphones Feature Summary

  • Integrates high acoustic overload point mode for enhanced dynamic range handling
  • Supports low-power operation suitable for battery-constrained applications
  • Features bottom port design optimized for specific acoustic enclosure layouts

Microphones Applications

  • Mobile devices requiring compact audio input solutions
  • Wearable electronics with strict power budget constraints
  • IoT sensors needing reliable voice capture

Microphones Procurement Notes

Verify the end-of-life status prior to procurement as the manufacturer indicates this component will be discontinued. Confirm that existing inventory meets project requirements before finalizing orders. Ensure compatibility with current PCB footprints and soldering profiles. Review product change notifications for any potential revisions affecting form or function during the transition period.

Microphones Selection Notes

Select this component when a balance between low power consumption and high acoustic performance is required. The multi-mode capability allows flexibility in system integration. Consider the bottom port orientation for acoustic path design. Evaluate the end-of-life status against long-term production needs and potential replacement strategies.

Microphones Part Context

This part belongs to the SmartSound family of MEMS microphones by TDK InvenSense. It represents a specialized solution combining digital signal processing with miniature packaging. The technology targets modern portable electronics where size and power efficiency are critical design parameters.

Microphones Replacement Considerations

Consult official documentation for confirmed substitute part numbers due to the end-of-life status.

MMICT3903-00-012MMICT3903-00-012

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