MML4403-GM3

RF Diode Overview

The MML4403-GM3 is a dual PIN diode designed for fast switching applications, specifically configured as an MRI receiver protection device. Manufactured by Microchip Technology under the MML4400 series, it utilizes a GM3 surface-mount package. Key electrical parameters include a maximum diode capacitance of 1.5 pF and a maximum series resistance of 1 Ohm at maximum intermediate frequency. The component features a carrier lifetime of 30 ns and a reverse current of 10 uA. It operates within a temperature range of -55°C to +150°C.

RF Diode Feature Summary

• Dual configuration providing two independent PIN diodes in a single compact package.
• Optimized for MRI receiver protection with high-speed switching capabilities.
• Low parasitic capacitance and series resistance suitable for RF signal paths.

RF Diode Applications

• MRI receiver front-end protection circuits
• RF signal switching networks
• High-frequency microwave applications

RF Diode Procurement Notes

Verify the manufacturer designation, as documentation references both Microsemi and Microchip Technology due to corporate acquisition history. Confirm the specific suffix GM3 corresponds to the required GM3 surface-mount package. Ensure the component meets the intended thermal operating range of -55°C to +150°C for the target environment.

RF Diode Selection Notes

Select this component when dual isolated PIN diodes are required for rapid RF switching or protection. The 30 ns carrier lifetime supports high-speed operation. Verify that the 1.5 pF maximum capacitance and 1 Ohm series resistance align with the system's insertion loss and isolation requirements.

RF Diode Part Context

This part belongs to the MML4400 series of PIN diodes from Microchip Technology. These devices are engineered for robust performance in demanding RF environments. The MML4403-GM3 variant specifically addresses the need for compact, dual-diode solutions in sensitive medical imaging equipment.

RF Diode Replacement Considerations

Consult official Microchip or Microsemi documentation for qualified substitute part numbers. Cross-compatibility depends on matching pinout, package dimensions (GM3), and critical RF parameters such as capacitance and switching speed.