— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC REG CONV I.MX6 12OUT 56HVQFN
- Series:-
- Mfr:NXP USA Inc.
- Package:Tray
- Applications:Converter, i.MX6
- Voltage - Input:2.8V ~ 4.5V
- Number of Outputs:12
- Voltage - Output:Multiple
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-VFQFN Exposed Pad
- Supplier Device Package:56-HVQFN (8x8)
- Grade:-
- Qualification:-
Download product information
Overview
The MMPF0100F1AEP is a specialized processor power management integrated circuit (PMIC) from NXP Semiconductors, designed for i.MX6 and i.MX6SoloX applications. It features a QFN-56 package with an input voltage range of 2.8 V to 4.5 V. The device integrates four buck converters, six low-dropout regulators (LDOs), and one boost converter. It supports output voltages from 300 mV to 5.15 V and operates within a temperature range of -40°C to +85°C.
Feature Summary
- Integrates multiple configurable voltage regulators including buck, LDO, and boost stages for comprehensive power distribution.
- Supports pre-programmed configurations via One-Time Programmable (OTP) registers for simplified system initialization.
- Provides I2C interface access for dynamic configuration of regulator voltages and startup timing sequences.
Applications
- i.MX6 SoloX heterogeneous processing systems
- Industrial automation control units
- Medical instrumentation power supplies
Procurement Notes
Verify the specific mask revision suffix (F1) against current engineering change notices to ensure compatibility with target board layouts. Confirm that the QFN-56 thermal pad requirements match the PCB design specifications. Ensure ESD handling procedures are followed during assembly due to moisture sensitivity classification.
Selection Notes
Select this component when designing systems based on NXP i.MX6 or i.MX6SoloX processors requiring a single-chip PM solution. It is suitable for applications needing multiple regulated rails with programmable sequencing. Consider the QFN-56 footprint constraints and thermal dissipation capabilities during the initial hardware architecture phase.
Part Context
This part belongs to the MMPF0100 series of power management ICs. It is specifically engineered to support the power domain requirements of NXP's i.MX6 family of application processors. The device consolidates multiple discrete power components into a single integrated solution to reduce board space and simplify design complexity.
Replacement Considerations
The MMPF0100F0EP is a documented variant within the same product family. Verify pin-to-pin compatibility and functional equivalence before substitution. Ensure that any replacement maintains the required OTP programming status and regulatory compliance for the target application.
ChipApex | Global Electronic Components Supplier









