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Product Detailed Parameters
- Description:IC REG CONV I.MX6 12OUT 56QFN
- Series:-
- Mfr:NXP USA Inc.
- Package:Tray
- Applications:Converter, i.MX6
- Voltage - Input:2.8V ~ 4.5V
- Number of Outputs:12
- Voltage - Output:Multiple
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount, Wettable Flank
- Package / Case:56-VFQFN Exposed Pad
- Supplier Device Package:56-QFN-EP (8x8)
- Grade:-
- Qualification:-
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Overview
The MMPF0100NPANES is a specialized power management integrated circuit (PMIC) designed for NXP i.MX6 processors. It features a 56-VFQFN exposed pad package with dimensions of 8x8 mm and a height of 0.85 mm. The device operates within an input voltage range of 2.8 V to 4.5 V and supports output voltages from 300 mV to 5.15 V. It integrates four or six buck converters, six low-dropout regulators (LDOs), and one boost converter, providing a total of twelve regulated outputs. The component is qualified to AEC-Q100 standards and functions reliably across a temperature range of -40°C to 105°C.
Feature Summary
- Integrates multiple switching regulators and LDOs into a single compact package for efficient power distribution.
- Includes a dedicated boost converter to support system requirements beyond the primary input voltage.
- Designed specifically for compatibility with NXP i.MX6 application processor families.
- Features a surface-mount QFN package with wettable flanks to facilitate automated assembly.
Applications
- i.MX 6SoloX Applications Processor systems
- i.MX 6DualLite Multimedia Applications Processor systems
- Industrial building automation devices
- Medical equipment requiring stable power rails
Procurement Notes
Verify that the specific suffix NPANES matches the required packaging configuration and moisture sensitivity level before ordering. Confirm that the AEC-Q100 automotive qualification aligns with the target application's environmental stress requirements. Ensure the 56-pin QFN footprint on the PCB layout corresponds exactly to the 8x8 mm package dimensions specified in the mechanical drawings.
Selection Notes
Select this PMIC when designing systems based on the i.MX6 family that require a consolidated power solution. Evaluate the total current capacity of the integrated buck and LDO stages against the processor's dynamic load profile. Consider the thermal dissipation capabilities of the exposed pad design if operating near the upper limits of the specified temperature range.
Part Context
This component belongs to the MMPF0100 series of specialized PMICs developed by NXP USA Inc. It serves as a critical companion chip for various i.MX6 processors, including the SoloX and DualLite variants. The series provides tailored power sequencing and regulation to meet the complex voltage domain requirements of these heterogeneous computing platforms.
Replacement Considerations
The MMPF0100NPAEPR2 is a documented variant within the same product family. Verify pin-to-pin compatibility and functional equivalence before substitution. Ensure that any alternative selection maintains the required input voltage range and output configuration for the specific i.MX6 processor being used.
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