MMPF0200F0AEP

Overview

The MMPF0200F0AEP is a specialized Power Management Integrated Circuit (PMIC) designed for i.MX6 processors. It integrates multiple power rails including buck converters, LDOs, and boost regulators within a 56-pin QFN package. The device supports input voltages from 2.8V to 4.5V and operates across an extended temperature range of -40°C to +85°C. Key specifications include up to 2.5A output current capability and maximum output voltages reaching 5.15V, ensuring stable power delivery for complex system-on-chip architectures.

Feature Summary

• Integrated multi-rail power management solution tailored for heterogeneous processing systems
• Supports advanced power sequencing and monitoring for processor core stability
• Compact surface-mount packaging facilitates efficient board space utilization

Applications

• i.MX 6SoloX processor-based embedded systems
• Automotive infotainment and connectivity modules
• Industrial control units requiring robust power regulation

Procurement Notes

Verify the specific suffix code against official NXP documentation to confirm exact pinout and pre-programmed configuration settings. Ensure compatibility with the target i.MX6 series processor variant before integration. Cross-reference the datasheet revision history to validate operational parameters and thermal characteristics for your specific application environment.

Selection Notes

Select this component when designing systems based on i.MX6 or i.MX 6SoloX processors that require a consolidated power management solution. Consider the 56-QFN package constraints and thermal dissipation requirements during layout. Verify that the integrated regulator outputs align with the voltage and current demands of the CPU cores, memory, and peripheral interfaces in the target design.

Part Context

This PMIC belongs to the MMPF0200 family, specifically engineered to support NXP's i.MX6 application processors. It complements the processor by providing necessary power rails for Cortex-A9 and Cortex-M4 cores, as well as I/O and analog sections. The component simplifies power design by integrating multiple functions into a single chip, reducing external component count and board complexity.

Replacement Considerations

Consult official substitution lists for verified alternatives such as MMPF0200F3AEP or MMPF0200NPAZES. Confirm functional equivalence regarding output configurations and package dimensions before replacing.