— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC REG CONV I.MX6 11OUT 56HVQFN
- Series:-
- Mfr:NXP USA Inc.
- Package:Tray
- Applications:Converter, i.MX6
- Voltage - Input:2.8V ~ 4.5V
- Number of Outputs:11
- Voltage - Output:Multiple
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-VFQFN Exposed Pad
- Supplier Device Package:56-HVQFN (8x8)
- Grade:-
- Qualification:-
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Overview
The MMPF0200F6AEP is a power management integrated circuit (PMIC) manufactured by NXP USA Inc., designed specifically for i.MX 6 series applications. It features an input voltage range of 2.8V to 4.5V and provides 11 distinct output channels. The device is housed in a 56-VFQFN exposed pad package, measuring 8x8 mm, with wettable flanks for enhanced solderability. It operates within a temperature range of -40°C to 105°C and holds AEC-Q100 automotive qualification.
Feature Summary
- Provides multiple regulated output voltages tailored for complex system-on-chip power sequencing requirements
- Integrates high-efficiency switching regulators and low-dropout linear regulators within a single compact footprint
- Supports advanced power management functions including programmable startup sequences and fault protection mechanisms
Applications
- i.MX 6SoloX processor systems
- i.MX 6Solo multimedia processors
- i.MX 6DualLite multimedia processors
- Automotive infotainment and connected radio systems
Procurement Notes
Verify the specific suffix F6AE against the official NXP datasheet to confirm pinout compatibility and electrical characteristics. Ensure the procurement channel provides valid traceability documentation. Confirm that the 56-QFN-EP package variant matches the target PCB land pattern design specifications before finalizing orders.
Selection Notes
Select this component when designing systems based on i.MX 6 family processors requiring a dedicated, multi-output PMIC solution. Consider the 11-output capacity and automotive-grade reliability (-40°C to 105°C) for robust industrial or vehicle applications. Evaluate the 56-VFQFN package constraints against available board space and thermal dissipation requirements for the specific enclosure design.
Part Context
This part belongs to the NXP MMPF0200 series of power management ICs. These devices are engineered as companion chips for NXP's i.MX 6 application processors, providing the necessary power rails and sequencing logic. The series supports various configurations to meet the diverse power needs of multimedia and automotive platforms.
Replacement Considerations
MMPF0200NPAZES
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