MMPQ2222AR2

Overview

The onsemi MMPQ2222AR2 is an NPN multi-chip general-purpose amplifier housed in a 16-pin SOIC package. It integrates four discrete transistors to provide medium power amplification and switching capabilities with collector currents up to 500 mA. The device features a collector-emitter breakdown voltage of 40 V, a collector-base breakdown voltage of 75 V, and an emitter-base breakdown voltage of 5.0 V. Total device dissipation reaches 1,000 mW at 25°C, with a junction-to-ambient thermal resistance of 125 °C/W for the effective four-die configuration. Operating temperatures range from -55°C to +150°C.

Feature Summary

• Integrates four NPN transistors into a single surface-mount package for compact circuit design
• Supports high continuous collector current up to 500 mA for medium power applications
• Provides low saturation voltages suitable for efficient switching operations
• Features a high gain-bandwidth product of 300 MHz for signal processing

Applications

• Medium power amplifier circuits
• General-purpose switching applications
• Multi-channel signal processing systems

Procurement Notes

Verify the specific ordering suffix 'R2' against official documentation to confirm packing method details. Confirm that the component is sourced from the ON Semiconductor manufacturing system following the Fairchild integration. Ensure compliance with RoHS standards and verify the updated part number nomenclature if transitioning from legacy Fairchild underscore formats.

Selection Notes

Select this component when multiple identical NPN switching or amplifying stages are required within a limited board area. The integrated four-die architecture reduces component count compared to using individual transistors. Evaluate the total device dissipation rating of 1,000 mW against the thermal constraints of the PCB layout to ensure reliable operation under maximum load conditions.

Part Context

This device belongs to the FFB2222A/FMB2222A/MMPQ2222A family of NPN multi-chip general-purpose amplifiers. Originally developed by Fairchild Semiconductor, these parts were transitioned to ON Semiconductor, resulting in nomenclature updates where underscores were replaced by dashes. The MMPQ2222A variant specifically utilizes the SOIC-16 package to accommodate the four internal transistor structures.

Replacement Considerations

Direct equivalents include the FFB2222A (SC70-6) and FMB2222A (SSOT-6), though package dimensions differ significantly. Verify pinout compatibility before substitution. Legacy Fairchild part numbers containing underscores may require conversion to dash-separated formats for accurate sourcing.