MMTP-U-31-04-1-B

Overview

The MMTP-U-31-04-1-B is a rectangular connector housing manufactured by TE Connectivity AMP Connectors. It belongs to the MMTP series and is designed for board-to-board or backplane applications. The component features a multi-row configuration with 31 positions arranged in a single row, utilizing a 2.54 mm (0.100 inch) pitch. The housing is constructed from thermoplastic material, typically black in color, and supports through-hole mounting. It serves as a receptacle assembly intended for use with compatible pin contacts.

Feature Summary

• Multi-position rectangular housing design for high-density interconnects
• Through-hole mounting style for secure PCB attachment
• Thermoplastic construction providing electrical insulation
• Compatible with standard pin contact systems

Applications

• Industrial control system interconnections
• Communication equipment signal routing
• Test and measurement device assemblies

Procurement Notes

Verify the specific contact mating requirements before procurement, as this item is a housing only. Confirm that the selected contacts match the 2.54 mm pitch and termination type. Ensure the supplier provides original manufacturer documentation to guarantee authenticity. Check for any recent product change notices that may affect dimensions or materials. Validate RoHS compliance status if required by your manufacturing standards.

Selection Notes

Select this housing when a 31-position, 2.54 mm pitch solution is required. Consider the through-hole mounting constraint against available PCB space. Evaluate the mechanical retention needs of the application to ensure the housing design is suitable. Verify that the operating temperature range meets environmental specifications. Compare alternative series if higher density or different mounting styles are needed.

Part Context

This component is part of the MMTP series from TE Connectivity, which focuses on reliable rectangular connector solutions. The series is known for supporting various contact configurations and mounting options. The MMTP-U-31-04-1-B specifically addresses applications requiring multiple signal paths in a compact form factor. It complements other components in the ecosystem by providing standardized housing interfaces.

Replacement Considerations

Direct substitutes must maintain the 31-position count and 2.54 mm pitch. Verify compatibility with existing contact sets. Check dimensional tolerances to ensure fit within the enclosure. Review mounting hole patterns for PCB replacement scenarios.