MMZ1005S241CT000

Overview

The MMZ1005S241CT000 is a ferrite bead from the TDK MMZ series, designed for signal line noise suppression. It features a 0402 (1005 metric) surface-mount package with dimensions of 1.00mm length and 0.50mm width. The component provides an impedance of 240 Ohms at 100 MHz with a tolerance of 25%. It supports a maximum DC current of 400mA and has a maximum DC resistance of 280 milliohms. The device operates within a temperature range of -55°C to +125°C.

Feature Summary

• Prevents radiated noise from high-speed signal lines
• Maintains impedance characteristics at high frequencies
• Super small size suitable for compact designs

Applications

• High-speed signal line noise suppression
• General signal line filtering
• EMI suppression in compact electronic devices

Procurement Notes

Verify the specific suffix 'C' against datasheets to confirm packaging type, as suffixes may indicate variations in reel or tape specifications. Confirm RoHS3 compliance status for environmental regulations. Ensure the 0402 footprint matches the PCB design constraints. Check for any product change notices related to the MMZ series that might affect long-term availability or material composition.

Selection Notes

Select this component when a 240 Ohm impedance at 100 MHz is required for signal integrity. The 400mA current rating must exceed the operating current of the protected line. The 0402 package is chosen for space-constrained layouts. Compare DCR values to ensure minimal voltage drop across the signal path. Consider the -55°C to +125°C operating range for environmental suitability.

Part Context

This part belongs to the TDK MMZ series of chip ferrite beads. The MMZ series is known for providing effective noise suppression in small packages. The MMZ1005 designation indicates the 0402 metric size. This series is widely used in consumer electronics and industrial applications for EMI control.

Replacement Considerations

MMZ1005S241AT000 is listed as a discontinued direct substitute. Verify electrical equivalence and packaging compatibility before substitution.