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The TDK MMZ2012S800AT000 is a multi-layer ferrite bead chip designed for high-frequency noise suppression in signal lines. It features an impedance of 80 Ohms at a test frequency of 100 MHz with a tolerance of 25%. The component supports a maximum DC current of 800 mA and has a maximum DC resistance of 100 mOhms. It utilizes a surface-mount 0805 (2012 metric) package with dimensions of 2.00 mm length, 1.25 mm width, and 0.85 mm height. The device operates within a temperature range of -55°C to +125°C.
Verify the specific ordering suffix and packaging configuration against official TDK documentation prior to procurement. Confirm that the selected variant matches the required impedance and current ratings for the target application. Ensure compliance with RoHS directives if applicable to the end product. Cross-reference the manufacturer part number with distributor listings to confirm availability and authenticity. Review datasheet revisions for any updates regarding mechanical or electrical specifications.
Select this component based on the required 80 Ohm impedance at 100 MHz and the 800 mA current handling capability. Ensure the 0805 package size fits the available PCB real estate. Verify that the operating temperature range meets the environmental requirements of the final assembly. Consider the DC resistance value when calculating power loss in the circuit path. Confirm compatibility with standard reflow soldering profiles used in the manufacturing process.
This component belongs to the TDK MMZ series of multi-layer ferrite beads. These components are engineered to suppress electromagnetic interference in high-speed digital and RF circuits. The series offers various impedance values and current ratings packaged in standard metric sizes. They serve as passive filters to protect sensitive electronics from noise-induced malfunctions.
Mouser Electronics indicates this part is scheduled for obsolescence. Identify alternative ferrite beads with matching 80 Ohm impedance, 800 mA rating, and 0805 footprint. Verify that substitute components meet the same thermal and electrical performance criteria before integration.