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MOC3009XSM is listed in the Triac, SCR Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5.3KV TRIAC 1CH. Review the specifications below when checking this part for your BOM.
The MOC3009XSM is a random phase triac output optoisolator manufactured by Isocom Components. It integrates a gallium arsenide infrared emitting diode with a monolithic silicon triac detector, providing electrical isolation for control circuits. The device features a 6-pin DIP package and supports through-hole mounting. Key electrical parameters include a maximum forward voltage of 1.5V, an isolation voltage of 5300Vrms, and a typical rise/fall time of 2μs. It operates within a temperature range of -55°C to 100°C and complies with UL (E91231), VDE 0884, and CECC 00802 standards.
Verify the specific suffix 'XSM' against official Isocom documentation to confirm surface mount or tape-and-reel configuration details. Ensure that the 6-pin DIP form factor matches the target PCB footprint requirements. Cross-reference certification numbers such as UL E91231 and VDE 0884 with current regulatory databases to confirm active status. Confirm thermal management capabilities align with the specified operating temperature range of -55°C to 100°C for the intended environment.
Select this component when random phase triac triggering is required rather than zero-crossing detection, allowing for phase-angle control applications. The 5300Vrms isolation rating makes it suitable for high-voltage industrial environments where robust galvanic isolation is critical. Consider the 2μs response time for timing-sensitive AC switching tasks. Verify compatibility with the driving logic levels given the 1.5V maximum forward voltage specification.
The MOC3009XSM belongs to the MOC series of optocouplers produced by Isocom Components, a UK-based manufacturer specializing in infrared optoelectronic devices. This series is designed to replace common commercial optocouplers while offering specialized parameter selections for specific circuit designs. The part utilizes standard industry manufacturing processes and is available in various lead forms and packaging options to meet diverse assembly needs.
Public confirmed substitute part numbers are not provided in the source material.
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