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MOC8102-X009 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Vishay Semiconductor Opto Division. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 6-SMD. Review the specifications below when checking this part for your BOM.
The MOC8102-X009 is a single-channel transistor output optocoupler manufactured by Vishay Semiconductor Opto Division. It features an infrared-emitting diode optically coupled to an NPN phototransistor in a surface-mount SMD-6 package. Key electrical parameters include a high isolation voltage of 5300 Vrms, a collector-emitter saturation voltage maximum of 400 mV, and a forward current maximum of 60 mA. The device operates within a temperature range of -55°C to +100°C, with a typical rise time of 2 µs and fall time of 2 µs.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix X009 matches required packaging specifications. Check current lifecycle status as discontinuation notices may affect long-term availability. Ensure compliance with relevant RoHS directives before integration into final assemblies.
Select this component when high isolation voltage and compact surface-mount form factor are required. Consider the NPN phototransistor output configuration for compatible load interfaces. Evaluate thermal management requirements given the operating temperature range. Verify that the current transfer ratio meets the specific circuit gain requirements.
This part belongs to the MOC8102 family of optocouplers from Vishay. It shares functional similarities with other single-channel transistor output isolators but is distinguished by its specific SMD-6 packaging and high isolation rating. The series is commonly used in industrial and consumer electronics for safe signal interfacing across potential differences.
The MOC8102SD is identified as a substitute part with identical electrical and mechanical specifications from the same manufacturer. Verify pinout compatibility and package dimensions before substitution. Ensure all critical parameters match the original design requirements.
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