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MOC8102 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 6-DIP. Review the specifications below when checking this part for your BOM.
The MOC8102 is a single-channel transistor output optocoupler manufactured by Isocom Components. It integrates an infrared light-emitting diode and an NPN silicon phototransistor in a standard 6-pin dual in-line plastic package with the base pin left unconnected. The device provides high isolation voltage of 5300 Vrms and 7500 Vpk. Key electrical parameters include a minimum collector-emitter breakdown voltage of 30 V, a maximum forward current of 0.1 A, and a nominal current transfer ratio of 73%. It operates within a temperature range of -40°C to +100°C.
Verify that the specific order includes the correct suffix if lead spread or mounting variations are required. Confirm RoHS compliance status as per the latest manufacturer documentation. Ensure the supplier provides official datasheets matching the Isocom Components specification. Check for any specific handling requirements related to the ceramic or plastic packaging variants available in the series.
Select this component when high noise immunity is critical due to the unconnected base terminal. It is suitable for applications requiring galvanic isolation between low-voltage control circuits and higher-voltage loads. Consider the 6-pin DIP form factor for through-hole mounting needs. Evaluate the 5300 Vrms isolation rating against system safety standards.
The MOC8102 belongs to the MOC810x series of non-base lead optically coupled isolators from Isocom Components. This series shares common architectural features but varies in current transfer ratios and specific approval ratings. It is designed for general-purpose isolation tasks where robustness against electromagnetic interference is required.
Cross-reference with other manufacturers' 6-pin DIP optocouplers featuring unconnected bases. Verify pinout compatibility and isolation voltage ratings before substitution. Ensure thermal characteristics match the original design constraints.
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