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MOC8103300W is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 6-DIP. Review the specifications below when checking this part for your BOM.
The MOC8103300W is a single-channel optocoupler from onsemi's FOD series, housed in a 6-pin MDIP package. It features an NPN phototransistor output with a maximum collector-emitter voltage of 70V and a peak forward current of 50mA. The device provides high isolation capability with a rated isolation voltage of 5300Vrms. Key electrical parameters include a typical rise time of 18μs and fall time of 18μs, with a minimum current transfer ratio of 300% at IF=5mA. Operating temperature range spans from -55°C to 110°C.
Verify the specific suffix '300W' matches the required Current Transfer Ratio (CTR) bin, as this indicates the minimum gain specification. Confirm package type is 6-DIP/MDIP rather than standard 4-pin variants. Check RoHS compliance status for environmental regulations. Ensure supplier documentation references the official onsemi datasheet for accurate electrical characteristics and safety certifications.
Select this component when high isolation voltage and fast response are critical. The 6-pin package allows for separate emitter connections, improving noise immunity compared to 4-pin versions. Consider the 300% CTR bin for applications requiring higher output drive capability. Verify thermal management requirements given the 200mW power dissipation limit and wide temperature range.
This part belongs to onsemi's FOD series of optocouplers, designed for general-purpose isolation applications. The MOC8103 variant specifically offers enhanced isolation voltage compared to standard 4-pin counterparts. It is widely used in industrial and consumer electronics where reliable galvanic isolation is required between low-voltage control circuits and higher-voltage loads.
Direct pin-compatible replacements may include other 6-pin MDIP optocouplers with similar isolation ratings and CTR specifications. Verify that substitute parts meet the same safety certification requirements (UL/VDE/C-UL). Check if alternative packages maintain the same thermal and mechanical constraints for existing PCB layouts.
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