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MOC8103XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5.3KV 1CH TRANS. Review the specifications below when checking this part for your BOM.
The MOC8103XSM is a single-channel optocoupler from the Isocom ISP series, featuring an infrared LED coupled to an NPN silicon phototransistor. It utilizes a surface-mount DIP package with four pins and no base connection. Key electrical parameters include a maximum isolation voltage of 5300Vrms, a typical rise time of 4μs, and a typical fall time of 3μs. The device operates within a temperature range of -30°C to 100°C, has a maximum forward voltage of 1.4V, and supports UL certification.
Verify the specific suffix 'XSM' against official manufacturer documentation to confirm surface-mount compatibility and lead form. Ensure the procurement specification matches the required isolation voltage and current transfer ratio windows for the target application circuit design.
Select this component when a non-base lead phototransistor output is required to reduce coupled capacitance and noise. Consider the narrow current transfer ratio window for predictable open-loop gain stability in precision applications. Verify that the surface-mount package dimensions fit the available PCB real estate constraints.
This part belongs to the MOC810x series of optically coupled isolators manufactured by Isocom Components. The series typically includes variants like MOC8106 and MOC8107, offering standardized performance for industrial isolation needs. The XSM designation indicates a specific surface-mount configuration within this broader family of devices.
Public confirmed substitute part numbers are not available in the provided source material. Cross-reference with generic MOC8103 equivalents only if official substitution data is verified by the manufacturer.
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