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MOC8104X is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 6-DIP. Review the specifications below when checking this part for your BOM.
The MOC8104X is a single-channel optically coupled isolator manufactured by Isocom Components. It integrates an infrared LED and an NPN silicon phototransistor with an unconnected base pin within a 6-pin dual in-line plastic package. The device provides high isolation voltage of 5300Vrms and supports a maximum forward current of 60mA. Typical current transfer ratio ranges from 50% to 100%, with a collector-emitter breakdown voltage of 70V minimum. Operating temperature spans -55°C to 100°C, and it holds UL recognition and VDE approval.
Verify the specific suffix 'X' against official Isocom documentation to confirm lead form and packaging details. Ensure compliance requirements such as UL or VDE approvals match project specifications. Confirm RoHS status and lead-free characteristics prior to ordering. Cross-reference datasheet revisions to validate electrical parameters and mechanical dimensions.
Select this component when high noise immunity is required due to the unconnected base terminal. Suitable for applications demanding robust isolation between control and power circuits. Consider thermal management capabilities given the wide operating temperature range. Verify package type availability if surface mount variants are preferred over through-hole configurations.
Part of the MOC8101-8108 series featuring non-base lead optocouplers. Designed for general-purpose isolation in industrial and consumer electronics. Offers reliable performance in environments with significant electromagnetic interference. Compatible with standard DIP and SMD mounting techniques depending on suffix designation.
MOC8102X, MOC8103X, MOC8105X share similar architectural features and pinouts within the same family. Verify current transfer ratio and isolation voltage specifications when substituting. Ensure mechanical footprint compatibility for direct replacement scenarios.
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