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MOC8108XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5.3KV 1CH TRANS. Review the specifications below when checking this part for your BOM.
The MOC8108XSM is a surface-mount, single-channel phototransistor optocoupler from Isocom Components. It integrates an infrared-emitting diode and an NPN silicon phototransistor in a compact SMD package with no base connection. The device provides electrical isolation with a maximum forward voltage of 1.5V and supports a maximum input current of 60mA. It features a typical rise time of 2μs and a typical fall time of 3μs. The unit offers high isolation capability rated at 5300Vrms and operates within a temperature range of -55°C to 100°C.
Verify the specific suffix 'XSM' against official Isocom documentation to confirm surface-mount configuration and lead form. Ensure compliance requirements match project standards, as approvals such as UL and VDE are associated with the MOC8108 series. Confirm package dimensions and pinout compatibility during component selection.
Select this component when surface-mount technology is required for single-channel isolation applications. Consider the 5300Vrms isolation rating for safety-critical designs. Evaluate the 2μs/3μs switching speeds against system timing requirements. Verify that the absence of a base connection aligns with the circuit design needs.
The MOC8108XSM belongs to the MOC810x series of non-base lead optically coupled isolators. This series is widely recognized for use in power supply applications where reliable galvanic isolation is necessary. The XSM designation indicates a surface-mount variant, distinguishing it from through-hole DIP versions like the MOC8108X.
Equivalent parts include CNY17-1SMT&R and SFH628A-4SMT&R from Isocom. Cross-reference specifications such as isolation voltage and current transfer ratio before substitution.
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