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MOC8112XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5.3KV 1CH TRANS. Review the specifications below when checking this part for your BOM.
The MOC8112XSM is a surface-mount optically coupled isolator manufactured by Isocom Components. It integrates an infrared emitting diode and an NPN silicon phototransistor within a compact 6-pin Small Outline (SOIC) package. The device provides electrical isolation between input and output circuits, featuring a high isolation voltage rating of 5300 Vrms. Key electrical parameters include a maximum forward voltage of 1.5V and a collector-emitter breakdown voltage of 70V minimum. The unit operates across a temperature range from -55°C to 100°C and complies with RoHS standards.
Verify the specific suffix 'XSM' confirms the surface mount variant and tape-and-reel packaging configuration. Ensure the procurement documentation explicitly states compliance with RoHS directives and relevant safety certifications such as UL and VDE. Confirm that the component matches the 6-pin SOIC physical dimensions required for the target PCB footprint design.
Select this component when surface mount technology is required for high-density board layouts. The unconnected base pin design offers superior noise immunity compared to standard variants in high EMI environments. Verify that the 5300 Vrms isolation rating meets the safety requirements of the application interface. Ensure the operating temperature range covers the expected environmental conditions of the final assembly.
This part belongs to the MOC81xx series of non-base lead optically coupled isolators. The series utilizes an infrared LED paired with an NPN silicon phototransistor. The 'XSM' designation indicates the surface mount package style, distinguishing it from through-hole DIP or other lead form variations within the same functional family.
Direct substitutes include other MOC8112 variants with compatible pinouts and electrical ratings. Verify that replacement parts maintain the 6-pin SOIC package and 5300 Vrms isolation specification. Cross-reference manufacturer datasheets to confirm identical current transfer ratio and switching speed characteristics.
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