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MOCD208R1VM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 2.5KV 2CH TRANS 8-SOIC. Review the specifications below when checking this part for your BOM.
The MOCD208R1VM is a dual-channel phototransistor output optocoupler manufactured by onsemi. It features an infrared LED coupled to NPN phototransistors in an 8-SOIC package. Key electrical parameters include a 2500Vrms isolation voltage, a collector-emitter saturation voltage of 400mV maximum, and a forward voltage of 1.5V maximum. The device supports a continuous forward current of 60mA and provides a collector current of 150mA per channel. It operates within a temperature range of -40°C to 100°C.
Verify component status carefully as this specific suffix variant may be discontinued or obsolete. Confirm availability through authorized distributors only. Ensure the replacement part number matches the required pinout and electrical specifications. Check RoHS compliance documentation before integration into new designs. Validate that the supplier provides genuine manufacturer packaging and traceability records.
Select this component when dual-channel isolation is required in a compact form factor. Consider the 2500Vrms isolation rating for safety-critical applications. Evaluate the 150mA collector current capacity against load requirements. Review the switching times if high-speed data transmission is necessary. Compare against active series parts like MOCD208M for long-term supply stability.
This device belongs to the MOCD208 family of dual-channel optocouplers from onsemi. It shares architectural similarities with other members but differs in specific suffix designations related to tape-and-reel packaging or manufacturing revisions. The family targets general-purpose isolation needs in industrial and consumer electronics.
MOCD208M is a confirmed parametric equivalent substitute available from onsemi. Verify that the alternative meets all electrical and mechanical requirements. Ensure compatibility with existing PCB footprints and assembly processes.
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