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The MP4008GS-Z is a high-brightness, high-current accuracy white LED boost controller from Monolithic Power Systems. It operates as a current control mode controller with a fixed switching frequency of 180 kHz. The device supports both Boost and SEPIC topologies for driving LEDs within an input voltage range of 9 V to 28 V. It features a 280 mV feedback voltage with ±1.8% accuracy and utilizes fast PWM dimming for high contrast ratios. The component is housed in an SOIC-8 package and includes comprehensive protection mechanisms such as overvoltage, overcurrent, and thermal shutdown.
Verify the specific suffix designation when ordering, as it indicates the tape and reel packaging configuration required for automated assembly processes. Confirm that the selected variant aligns with your manufacturing equipment specifications. Ensure compliance with RoHS3 standards and check moisture sensitivity levels prior to storage and soldering procedures to maintain component integrity during production.
Select this controller for designs requiring a fixed 180 kHz switching frequency to simplify EMI filtering requirements. The wide 9 V to 28 V input range accommodates various battery or supply configurations. Consider the SOIC-8 package size for space-constrained PCB layouts. Evaluate the need for SEPIC topology if input voltage may drop below output requirements, ensuring stable operation across the entire operating temperature range.
This component belongs to the MP4008 series of LED lighting drivers manufactured by Monolithic Power Systems. It is specifically engineered for high-current accuracy applications where consistent brightness is critical. The GS-Z suffix denotes a specific packaging option within the broader MP4008 product family, distinguishing it from other variants like the GS-P model while maintaining identical electrical performance characteristics.
The MP4008GS-P is a direct substitute offering identical electrical specifications and functionality. Both variants share the same SOIC-8 footprint and pinout configuration. Designers can interchange these parts without modifying the surrounding circuitry, provided the packaging preference matches the assembly line capabilities.