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The MP5515GU-P is a specialized power management IC designed for enterprise solid-state drives and NVDIMM applications. It operates with an input voltage range of 2.7 V to 18 V and supports up to 5 A output current. The device features bidirectional power backup management, integrated hot-swap capabilities, and an I2C ADC interface. It functions within a temperature range of -40°C to +125°C and dissipates up to 3.57 W of power. The component is housed in a QFN-30 package.
Verify the specific suffix 'GU-P' against official Monolithic Power Systems documentation to confirm pinout and thermal specifications. Ensure compatibility with the EVKT-5515 evaluation kit if development support is required. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly to prevent package damage during manufacturing processes.
Select this component when designing power architectures for enterprise SSDs requiring robust backup management. The integrated I2C ADC allows for precise monitoring without external sensors. Consider the QFN-30 package constraints for thermal dissipation, as the device handles significant power loads. Verify that the 18V maximum input rating aligns with the system's supply rails.
The MP5515 belongs to the MP5515 series of professional PMICs from Monolithic Power Systems. This series targets high-reliability storage applications where power integrity and backup continuity are critical. The GU-P designation indicates the specific package type and lead finish configuration within the MPS product lineup.
No public confirmed substitute part numbers are available in the provided documentation. Consult MPS technical support for direct replacements or cross-reference options based on specific electrical requirements.
It serves as a high-efficiency power backup and management unit specifically designed for SSD applications, handling input power conditioning and bidirectional backup power flow.
Yes, it integrates an I2C ADC interface, allowing for system monitoring and control via digital communication protocols.