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The MPA-254-WIFI/189-00055-01 is a surface-mount embedded antenna manufactured by Maxtena Inc. Designed for Wi-Fi applications, it operates within the 2.4 GHz and 5.8 GHz frequency bands. The component utilizes a ceramic stacked patch design to deliver high gain performance across dual bands. It features an I-PEX MHFI (U.FL) connector interface for direct board attachment. This passive PCB antenna is engineered for integration into compact wireless devices requiring reliable signal transmission in the specified RF spectrum.
Verify the specific I-PEX MHFI connector compatibility with your host board layout before procurement. Confirm that the embedded surface-mount package dimensions align with your PCB footprint requirements. Ensure the operating temperature range meets your device's environmental specifications. Cross-reference the datasheet for precise impedance matching parameters to ensure optimal RF performance in your final assembly.
Select this model when dual-band 2.4 GHz and 5.8 GHz coverage is required in a low-profile embedded format. The ceramic stacked patch construction offers superior gain compared to standard planar antennas. Consider the I-PEX MHFI interface if U.FL connectivity is preferred over SMA or other connectors. Evaluate space constraints as the embedded design suits tight internal packaging scenarios.
This part belongs to Maxtena's embedded antenna portfolio, specifically tailored for Wi-Fi applications. It complements their broader range of GNSS and cellular antennas by addressing the specific needs of short-range wireless communication. The product line emphasizes compactness and high performance for modern portable electronics.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires verifying identical electrical characteristics, mechanical dimensions, and connector type (I-PEX MHFI). Consult Maxtena technical support for potential alternatives if this specific variant is discontinued.