MPA-258-WIFI/189-00051-01

Overview

The MPA-258-WIFI/189-00051-01 is a surface-mount RF antenna manufactured by Maxtena Inc. It utilizes ceramic patch technology designed for Wi-Fi applications. The component features an I-PEX MHFI (U.FL) connector interface for direct board integration. This passive antenna is engineered for embedded wireless systems requiring compact form factors.

Feature Summary

• Surface-mount ceramic patch construction for reliable embedded integration
• Optimized for Wi-Fi frequency band operations
• Integrated I-PEX MHFI (U.FL) connector interface

Applications

• Embedded Wi-Fi terminal devices
• Compact wireless communication modules
• IoT hardware with limited PCB space

Procurement Notes

Verify the specific I-PEX connector mating compatibility with your design's U.FL footprint before procurement. Confirm that the ceramic package dimensions align with your assembly constraints. Ensure the supplier provides the official datasheet to validate electrical performance specifications for your target Wi-Fi frequencies.

Selection Notes

Select this model when a low-profile, surface-mount solution is required for Wi-Fi connectivity. The integrated U.FL connector simplifies routing compared to SMA variants. Consider the ceramic material properties for environmental stability in embedded deployments where space is constrained.

Part Context

This part belongs to Maxtena's embedded antenna portfolio, specifically targeting Wi-Fi applications. It complements other Maxtena products like the MPA-254-WIFI and MEA-LWIG-SM, offering a specialized surface-mount alternative for different mounting requirements and connector preferences within wireless device designs.

Replacement Considerations

The MPA-254-WIFI serves as a related variant within the same product family. Verify if the specific connector type or mounting style of the alternative meets your mechanical design requirements before substitution.