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Product Detailed Parameters
- Description:IC MPU MPC6XX 200MHZ 255FCCBGA
- Series:MPC6xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:200MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:255-BCBGA, FCCBGA
- Supplier Device Package:255-FCCBGA (21x21)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC603RRX200TC is a PowerPC 603e microprocessor implementing the PID7t-603e technical designator. It utilizes a 0.29 µm CMOS process with a core voltage of 2.5 V and I/O voltage of 3.3 V. The device features a 32-bit architecture with a maximum processor frequency of 200 MHz. It integrates 16-Kbyte instruction and data caches, MMUs with TLBs, and supports 255-pin CBGA or PBGA packages.
Feature Summary
- Superscalar execution capability issuing up to three instructions per clock cycle
- Integrated floating-point unit compliant with IEEE 754 standard
- Supports multiple power-saving modes including nap, doze, and sleep
- Includes JTAG boundary-scan for in-system testability
Applications
- High-performance embedded processing systems
- Industrial control applications requiring low-power operation
- Telecommunications infrastructure equipment
- Network routing and switching devices
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and speed bin. Ensure compatibility with existing system voltage requirements, specifically the 2.5 V core and 3.3 V I/O supplies. Confirm that the selected variant matches the required thermal characteristics and pinout configuration for the target PCB layout.
Selection Notes
Select this component when a 200 MHz superscalar RISC processor is required within the PowerPC 603e family. Consider the available package options, noting that the PBGA package is pin-compatible with the CBGA but limited to 200 MHz speeds. Evaluate power consumption profiles across different operational modes to ensure they meet system energy constraints.
Part Context
This part belongs to the PowerPC 603e microprocessor family manufactured by NXP (formerly Freescale). The 603e represents a low-power implementation of the PowerPC architecture, designed for high efficiency in embedded environments. It serves as a foundational processor for various commercial and industrial applications requiring robust 32-bit processing capabilities.
Replacement Considerations
The PBGA package is documented as a pin-compatible drop-in replacement for the CBGA package, provided the application operates at or below 200 MHz. Verify electrical specifications and thermal resistance values before substituting between package types.
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