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MPC603RRX266LC
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Product Detailed Parameters
- Description：IC MPU MPC6XX 266MHZ 255FCCBGA
- Series：MPC6xx
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：PowerPC 603e
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：266MHz
- Co-Processors/DSP：-
- RAM Controllers：-
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：-
- SATA：-
- USB：-
- Voltage - I/O：3.3V
- Operating Temperature：0°C ~ 105°C (TA)
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：255-BCBGA, FCCBGA
- Supplier Device Package：255-FCCBGA (21x21)
- Additional Interfaces：-
- Grade：-
- Qualification：-
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Overview
The MPC603RRX266LC is a PowerPC 603e RISC microprocessor implementing the PID7t-603e process. It features a 32-bit architecture with a maximum core frequency of 266 MHz and a selectable 32- or 64-bit external data bus. The device utilizes a 255-pin ceramic ball grid array (CBGA) package with a 1.27 mm pitch. Electrical operation requires a core supply voltage of 2.5 V ± 5% and an I/O supply voltage of 3.3 V ± 5%.
Feature Summary
- Superscalar execution capability issuing up to three instructions per clock cycle.
- Integrated 16-Kbyte instruction and data caches with LRU replacement algorithms.
- Supports multiple software-controllable power-saving modes including nap, doze, and sleep.
- Includes on-chip memory management units with translation lookaside buffers.
Applications
- Embedded systems requiring low-power RISC processing
- Industrial control applications
- Consumer electronics devices
Procurement Notes
Verify that the ordering suffix corresponds to the specific speed bin and package type required for the design. Confirm compatibility with the 2.5 V core and 3.3 V I/O voltage requirements. Ensure the CBGA package dimensions match the PCB footprint specifications provided in the datasheet.
Selection Notes
Select this component when a 266 MHz superscalar processor is needed within the PowerPC 603e family. Consider the CBGA package for higher speed support compared to PBGA alternatives. Evaluate thermal characteristics and power consumption profiles against system constraints before finalizing the selection.
Part Context
This part belongs to the PowerPC 603e microprocessor family manufactured by NXP USA Inc. (formerly Freescale). The PID7t-603e designation indicates a 0.29 µm CMOS process implementation. It serves as a low-power solution within the broader PowerPC architecture ecosystem.
Replacement Considerations
The PBGA package variant is a pin-compatible drop-in replacement but supports speeds only up to 200 MHz. Verify if the lower speed limit meets system requirements before substituting.
