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Product Detailed Parameters
- Description:IC MPU MPC6XX 300MHZ 255FCCBGA
- Series:MPC6xx
- Mfr:Freescale Semiconductor
- Package:Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:255-BCBGA, FCCBGA
- Supplier Device Package:255-FCCBGA (21x21)
- Additional Interfaces:-
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Overview
The MPC603RVG300LC is a 32-bit RISC microprocessor belonging to the PowerPC 603e family. It operates at a clock frequency of 300 MHz and features an integrated floating-point unit (FPU) compliant with IEEE 754 standards. The device utilizes a CBGA-255 ceramic package with a 1.27 mm pitch. Key architectural specifications include dual 16 KB caches, a 64-bit external data bus, and support for boundary scan testing via JTAG.
Feature Summary
- Superscalar architecture capable of executing up to three instructions per clock cycle
- Integrated floating-point unit supporting single and double precision operations
- On-chip debug support with selectable bus clock configurations
- Multiple low-power operating modes including Nap, Doze, and Sleep
Applications
- High-performance embedded computing systems
- Industrial control applications requiring real-time processing
- Telecommunications infrastructure equipment
- Automotive electronic control units
Procurement Notes
Verify component authenticity through authorized distribution channels or direct manufacturer verification. Confirm that the specific part number matches the required package type and speed grade. Ensure compliance with relevant export control classifications and environmental regulations prior to procurement.
Selection Notes
Select this processor for designs requiring high computational throughput within a compact form factor. Evaluate thermal management requirements due to power consumption characteristics at maximum frequency. Consider system memory interface compatibility and peripheral integration needs when finalizing the hardware design.
Part Context
This component is part of the broader PowerPC 603e microprocessor family, which offers various speed grades and packaging options. It represents a high-performance implementation designed for demanding embedded environments where reliability and processing speed are critical factors for system performance.
Replacement Considerations
Consult official documentation for compatible upgrades within the same family series. Verify pinout and electrical parameter compatibility before substituting with alternative speed grades or package variants from the manufacturer.
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