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Product Detailed Parameters
- Description:IC MPU MPC7XX 350MHZ 255FCPBGA
- Series:MPC7xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:350MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:255-BBGA, FCBGA
- Supplier Device Package:255-FCPBGA (21x21)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC745BPX350LE is a RISC microprocessor implementing the PowerPC instruction set architecture. It operates at a maximum core frequency of 350 MHz with a processor bus frequency range of 25 to 100 MHz. The device utilizes a 0.22 µm CMOS technology and features two integer units, a floating-point unit, and a branch processing unit. Unlike the MPC755, it lacks an internal L2 cache interface but supports external SRAMs via a dedicated L2 controller. It includes 32 Kbyte instruction and data caches, memory management units, and power management modes including doze, nap, and sleep.
Feature Summary
- Implements the PowerPC instruction set architecture with out-of-order execution capabilities
- Includes integrated thermal management assist unit for junction temperature regulation
- Supports dynamic power management and multiple low-power operating modes
- Features a 60x bus interface compatible with standard processor protocols
Applications
- Low-cost embedded systems requiring reduced power consumption
- Network infrastructure equipment such as base stations
- Signal processing applications utilizing vector execution units
- Pervasive computing devices with strict thermal constraints
Procurement Notes
Verify the specific speed grade and package type against the ordering information section of the datasheet. Confirm that the required I/O voltage levels (2.5 V or 3.3 V) match the system design, as these are selected by configuration pins. Ensure compatibility with the 60x bus protocol and check for any relevant errata documents before finalizing procurement specifications.
Selection Notes
Select this component for applications prioritizing low power consumption over high-frequency performance compared to other members of the MPC74xx family. Consider the absence of an on-die L2 cache when designing memory subsystems, as external SRAMs must be managed via the dedicated L2 interface. Evaluate the thermal characteristics and ensure adequate heat dissipation solutions are in place for the PBGA package.
Part Context
The MPC745 belongs to the MPC74xx family of Power Architecture processors manufactured using 0.22 µm CMOS technology. It shares the same core architecture as the MPC755 but omits the internal L2 cache controller and tags. This differentiation allows for cost-sensitive designs where external memory controllers are preferred or already present in the system architecture.
Replacement Considerations
The MPC755 serves as a functional replacement if an internal L2 cache interface is required. Other models within the MPC74xx series may offer different clock speeds or process technologies. Verify pinout compatibility and software instruction set alignment when substituting with alternative part numbers.
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