— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC7XX 300MHZ 360FCPBGA
- Series:MPC7xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:360-BBGA, FCBGA
- Supplier Device Package:360-FCPBGA (25x25)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC755BPX300LE is a PowerPC-based RISC microprocessor manufactured by NXP Semiconductors. It implements the e600 core architecture with a single processing core and a 32-bit data bus width. The device operates at a maximum clock frequency of 300 MHz and utilizes a CBGA-360 package for surface mount installation. It features an internal L2 cache interface supporting up to 1 MB, alongside 32 kB instruction and 32 kB data L1 caches. The processor supports fixed and floating-point instructions, operates on a 2 V core supply voltage, and accommodates I/O voltages of 2.5 V or 3.3 V. It functions within a temperature range of 0°C to +105°C.
Feature Summary
- Implements the PowerPC instruction set architecture with out-of-order execution capabilities.
- Integrates an internal Level 2 cache controller with support for external SRAMs.
- Includes a thermal management assist unit with on-chip sensor and control logic.
- Supports multiple low-power modes including doze, nap, and sleep states.
Applications
- Low-cost embedded systems requiring reduced instruction set computing
- Power management applications utilizing dynamic power management features
- Systems requiring IEEE 1149.1 JTAG interface for testability
Procurement Notes
Verify component authenticity through official manufacturer channels due to end-of-life status. Confirm specific mask number requirements if critical for power specifications. Ensure compatibility with existing system voltage levels and thermal constraints before integration. Review hardware specification addendums for any part-number-specific electrical changes.
Selection Notes
Select this component for designs requiring a PowerPC-compatible processor with integrated L2 cache interface capabilities. Consider the CBGA-360 package constraints for PCB layout. Evaluate thermal dissipation requirements against the specified junction-to-ambient resistance values. Verify that the 300 MHz operating speed meets the application's performance needs.
Part Context
This microprocessor belongs to the MPC755 family, which shares architectural similarities with the MPC745 but includes additional L2 cache interface functionality. The device is designed for low-power, low-cost system implementations. It represents a generation of processors focused on balancing performance with energy efficiency through advanced power management features.
Replacement Considerations
Consult NXP sales offices for recommended upgrades as this product is no longer in production. No direct public substitute part numbers are confirmed in the provided documentation.
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