— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC7XX 350MHZ 360CBGA
- Series:MPC7xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:350MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:360-BCBGA, FCCBGA
- Supplier Device Package:360-CBGA (25x25)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC755BRX350TE is a PowerPC e600 core microprocessor operating at 350 MHz. It features a single core with 32-bit data bus width, housed in a CBGA-360 package. The device includes 32 kB L1 instruction and data caches, with L2 cache options of 256 kB, 512 kB, or 1 MB. Operating voltage is 2 V, with I/O voltages of 2.5 V and 3.3 V. It supports AEC-Q100 qualification and operates between -40°C and +105°C.
Feature Summary
- Implements the PowerPC instruction set architecture with an e600 processor core.
- Integrates internal L2 tag combined with a dedicated L2 cache interface.
- Supports low-power management modes including doze, nap, and sleep.
- Includes integrated thermal management assist unit for junction temperature regulation.
Applications
- Low-cost embedded systems
- Low-power computing applications
- Automotive electronics requiring AEC-Q100 compliance
Procurement Notes
Verify component authenticity through official NXP channels due to discontinued status. Confirm package type matches system requirements as both CBGA and PBGA variants exist within the family. Ensure power supply specifications align with recommended operating conditions before integration.
Selection Notes
Select this part for designs requiring PowerPC compatibility with specific thermal constraints. Consider the CBGA package for interconnect reliability needs. Verify that the required L2 cache configuration is supported by the external memory controller design.
Part Context
This component belongs to the MPC755 RISC Microprocessor family implementing the PowerPC architecture. It shares functional similarities with the MPC745 but adds an internal L2 cache interface. The device utilizes 0.22 µm CMOS technology and is designed for systems prioritizing power efficiency alongside processing performance.
Replacement Considerations
Consult NXP sales offices for current upgrades as the product is no longer in production. No direct public substitute part numbers are confirmed in available documentation.
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