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MPC755BVT300LE
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Product Detailed Parameters
- Description：IC MPU MPC7XX 300MHZ 360FCPBGA
- Series：MPC7xx
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：PowerPC
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：300MHz
- Co-Processors/DSP：-
- RAM Controllers：-
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：-
- SATA：-
- USB：-
- Voltage - I/O：2.5V, 3.3V
- Operating Temperature：0°C ~ 105°C (TA)
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：360-BBGA, FCBGA
- Supplier Device Package：360-FCPBGA (25x25)
- Additional Interfaces：-
- Grade：-
- Qualification：-
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Overview
The MPC755BVT300LE is a PowerPC e600 core microprocessor operating at 300 MHz. It features a 32-bit data bus and supports L1 caches of 32 kB instruction and 32 kB data. The device includes an internal L2 tag with an external interface supporting up to 1 MB of cache. It operates on a 2.0 V core supply and supports selectable 2.5 V or 3.3 V I/O voltages. The component utilizes a 360-pin CBGA package and complies with AEC-Q100 automotive standards.
Feature Summary
- Implements the PowerPC e600 architecture for high-performance RISC processing
- Integrates an internal L2 controller with dedicated external cache interface
- Supports comprehensive power management modes including doze, nap, and sleep
- Includes integrated thermal management assist unit with on-chip sensor
Applications
- Automotive electronic control units requiring AEC-Q100 compliance
- Low-cost embedded systems utilizing PowerPC architecture
- Industrial applications requiring dynamic power management capabilities
Procurement Notes
Verify the specific ordering suffix against official NXP documentation to confirm voltage and package variations. Confirm current production status as legacy components may be discontinued. Ensure compatibility with existing PCB footprints for the 360-pin CBGA package before procurement.
Selection Notes
Select this component for designs requiring a single-core PowerPC solution with integrated L2 tagging. Verify that the system can support the required 2.0 V core voltage and appropriate I/O levels. Consider the thermal characteristics and available cooling solutions given the power consumption specifications in full-power mode.
Part Context
This part belongs to the MPC755 family of RISC microprocessors designed for low-power, cost-sensitive applications. It shares architectural similarities with the MPC745 but adds an internal L2 tag and cache interface. The device implements the standard PowerPC instruction set architecture for broad software compatibility.
Replacement Considerations
Consult official NXP documentation for direct substitutes. Legacy Freescale parts such as XPC755BRX300LE may share functional equivalence but require verification of electrical specifications and pinout compatibility.
