MPC755BVT350LE

MPC755BVT350LE

$85.48
  • Description:IC MPU MPC7XX 350MHZ 360FCPBGA
  • Series:MPC7xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:bc8ff2d7d0dc Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC7XX 350MHZ 360FCPBGA
  • Series:MPC7xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:PowerPC
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:350MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:360-BBGA, FCBGA
  • Supplier Device Package:360-FCPBGA (25x25)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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MPC755BVT350LE

Overview

The MPC755BVT350LE is a PowerPC-based RISC microprocessor manufactured by NXP Semiconductors. It implements the PowerPC instruction set architecture and features a single e600 core with a maximum clock frequency of 350 MHz. The device utilizes a 32-bit data bus width and operates at a core voltage of 2 V, supporting I/O voltages of 2.5 V and 3.3 V. It includes 32 kB L1 instruction cache and 32 kB L1 data cache. The processor supports L2 cache sizes of 256 kB, 512 kB, or 1 MB via an internal controller. It is housed in a CBGA-360 package and complies with AEC-Q100 automotive qualification standards.

Feature Summary

  • Implements the PowerPC instruction set architecture with out-of-order execution capabilities
  • Integrates an internal Level 2 cache controller for external SRAM connectivity
  • Supports multiple low-power management modes including doze, nap, and sleep states
  • Includes an integrated thermal management assist unit with on-chip sensor

Applications

  • Automotive electronic control units requiring AEC-Q100 compliance
  • Low-cost embedded systems utilizing PowerPC architecture
  • Industrial control applications needing dynamic power management

Procurement Notes

Verify component authenticity through authorized distributors as this part may be end-of-life. Confirm specific mask revision and manufacturing date codes against project requirements. Ensure compatibility with existing PCB footprints for the CBGA-360 package. Validate that system power supplies meet the specified 2.0 V core and selectable 2.5 V/3.3 V I/O voltage ranges.

Selection Notes

Select this component when a PowerPC-compatible processor with integrated L2 cache interface is required. Consider the 350 MHz operating speed and 32-bit bus width for system performance needs. Verify that the application environment supports the specified junction temperature range. Ensure the design accommodates the ceramic ball grid array package constraints.

Part Context

This microprocessor belongs to the MPC755 family, which targets low-power and low-cost system implementations. It shares architectural similarities with the MPC745 but adds an internal L2 cache interface. The device is designed for robust operation in environments requiring thermal management and strict power consumption limits.

Replacement Considerations

Consult official documentation for direct substitutes. The MPC745 serves as a related variant lacking the L2 cache interface. Contact manufacturer sales offices for current upgrade recommendations as production status may vary.

MPC755BVT350LEMPC755BVT350LE
$85.48
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