MPC755CRX400LE

Overview

The MPC755CRX400LE is a PowerPC-based RISC microprocessor manufactured by NXP Semiconductors. It implements the PowerPC instruction set architecture and features an e600 core with a single processing unit. The device operates at a maximum clock frequency of 400 MHz and utilizes a 32-bit data bus width. It is housed in a CBGA-360 package designed for surface mount installation. The processor supports L1 caches consisting of 32 kB instruction and 32 kB data memory, alongside configurable L2 cache sizes of 256 kB, 512 kB, or 1 MB. Operating conditions include a supply voltage of 2 V and a temperature range from 0°C to +105°C.

Feature Summary

• Implements the PowerPC instruction set architecture with integrated floating-point capabilities.
• Features a dedicated internal L2 tag combined with a specialized L2 cache interface.
• Supports multiple low-power management modes including doze, nap, and sleep states.
• Includes an integrated thermal management assist unit with on-chip sensor logic.

Applications

• Network routers
• Base station controllers
• Industrial computers

Procurement Notes

Verify component authenticity through official manufacturer channels as this part number may be discontinued. Confirm specific lot codes and mask revisions against current hardware specifications before integration. Ensure compliance with RoHS directives if required by the target application environment. Cross-reference ordering suffixes carefully to match exact electrical and packaging requirements.

Selection Notes

Select this component for designs requiring high reliability and real-time processing capabilities within industrial environments. Evaluate thermal dissipation requirements based on the CBGA package characteristics and specified power consumption levels. Ensure the system design accommodates the specific voltage tolerances and operating temperature ranges defined in the datasheet.

Part Context

This microprocessor belongs to the MPC755 family, which targets low-cost, low-power systems. It shares architectural similarities with the MPC745 but includes additional L2 cache interface support. The device is built using 0.22 µm CMOS technology and contains approximately 6.75 million transistors. It is designed for applications demanding robust performance and strict timing constraints.

Replacement Considerations

Contact the manufacturer sales office for recommended upgrades or replacement devices as this product is no longer in production.

FAQ

What is the difference between the B and C process descriptors in the part number?

Both B and C represent HiP4DP 0.18-micron copper interconnect processes. The C version typically indicates a later batch or process tweak that may offer higher frequency limits or improved electrical characteristics compared to the B version.

How does the 'L' modifier affect the operating conditions?

The 'L' designation specifies a working voltage of 2.0 V ±100 mV and defines an industrial-grade junction temperature range from 0°C to 105°C.