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Product Detailed Parameters
- Description:IC MPU MPC7XX 400MHZ 360FCPBGA
- Series:MPC7xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:400MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:360-BBGA, FCBGA
- Supplier Device Package:360-FCPBGA (25x25)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC755CVT400LE is a PowerPC-based RISC microprocessor featuring an e600 core operating at 400 MHz. It utilizes a 32-bit data bus and supports L1 caches of 32 kB instruction and 32 kB data. The device includes an internal L2 cache controller with support for external SRAMs up to 1 MB. Operating voltage is 2.0 V ± 100 mV, with I/O voltages selectable between 2.5 V and 3.3 V. It employs a 360-pin PBGA package and operates within a temperature range of 0°C to +105°C.
Feature Summary
- Implements the PowerPC instruction set architecture with out-of-order execution capabilities.
- Integrates an internal Level 2 cache controller supporting external synchronous BurstRAMs.
- Includes a Memory Management Unit (MMU) with hardware tablewalk support and virtual memory management.
- Features integrated thermal management assist units with on-chip sensors for junction temperature regulation.
Applications
- Low-cost, low-power embedded systems requiring high reliability.
- Network infrastructure equipment such as routers and switches.
- Industrial control applications demanding extended temperature operation ranges.
Procurement Notes
Verify the specific ordering suffix against official NXP documentation to confirm package type and speed grade. Confirm RoHS compliance status directly from the manufacturer datasheet, as legacy components may vary in regulatory adherence. Ensure compatibility with existing PCB footprints and power supply designs before procurement.
Selection Notes
Select this component for applications requiring PowerPC architecture compatibility and robust thermal management features. Evaluate system requirements against the 400 MHz maximum frequency and available L2 cache configurations. Consider the 360-pin PBGA package constraints during mechanical design and thermal dissipation planning.
Part Context
The MPC755 belongs to the PowerPC 750 family of microprocessors designed by Freescale Semiconductor, now NXP Semiconductors. This series targets performance-critical embedded markets. The CVT suffix indicates a specific speed grade and plastic ball grid array (PBGA) packaging variant within the broader MPC755 product line.
Replacement Considerations
Consult NXP sales offices for current replacement devices, as this part number is no longer in production. Verify architectural compatibility if migrating to newer PowerPC or ARM-based processors.
FAQ
What is the function of the Thermal Assist Unit (TAU)?
The TAU consists of an on-chip thermal sensor and control logic that provides interrupts for software regulation of the junction temperature.
How is the I/O voltage configured?
The input threshold selection for the processor and L2 buses is determined by the BVSEL and L2VSEL configuration pins, allowing support for either 2.5 V or 3.3 V nominal levels.
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