— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 200MHZ 357BGA
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:200MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:357-BBGA
- Supplier Device Package:357-PBGA (25x25)
- Additional Interfaces:I2C, I²O, PCI, UART
Download product information
Overview
The MPC8241LVR200D is a 32-bit RISC microprocessor based on the PowerPC 603e core, operating at a clock frequency of 200 MHz. It utilizes a PBGA-357 package with dimensions of 25 x 25 mm and a height of 1.27 mm. The device features an integrated host processor architecture with a 32-bit address bus and a 64-bit external data bus. Key specifications include a maximum PCI interface speed of 66 MHz, support for up to 2 GB of SDRAM via a 133 MHz memory controller, and integrated L1 instruction and data caches.
Feature Summary
- Integrates a high-performance PowerPC 603e RISC processor core with floating-point capabilities
- Provides a 32-bit PCI interface compliant with PCI 2.2 standards for system connectivity
- Includes a flexible memory controller supporting SDRAM and EDO DRAM configurations
- Features dual-channel DMA controllers and a message unit with I2O support
Applications
- Network infrastructure equipment such as routers and switches
- Network storage applications requiring integrated control processing
- Image display systems and enterprise I/O processors
- Embedded computing platforms in telecommunications markets
Procurement Notes
Verify component authenticity through authorized NXP or Freescale distributors. Confirm package integrity and pin alignment against the PBGA-357 specification. Ensure compliance with RoHS directives if lead-free status is required for the specific manufacturing lot. Validate that the operating temperature range meets the design requirements for the target application environment.
Selection Notes
Select this component when a single-chip solution replaces multiple discrete logic components to reduce board space and power consumption. Consider the 200 MHz performance level relative to higher-frequency variants like the 266 MHz models. Evaluate the integration of PCI and memory controllers against designs requiring separate bridge chips. Assess thermal management needs for the BGA package in enclosed system enclosures.
Part Context
This part belongs to the MPC82xx series of integrated host processors designed for cost-sensitive embedded applications. It consolidates functions typically handled by five separate chips into one die. The series targets markets where space, power, and performance are critical constraints, offering a standardized Power Architecture software compatibility layer for development ease.
Replacement Considerations
Check for direct pin-compatible upgrades within the MPC82xx family, such as the MPC8241LVR266D, which offers higher clock speeds. Verify software compatibility when migrating between different core frequencies within the same architectural family.
ChipApex | Global Electronic Components Supplier






