— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 200MHZ 357BGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:200MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:357-BBGA
- Supplier Device Package:357-PBGA (25x25)
- Additional Interfaces:I2C, I²O, PCI, UART
- Grade:-
- Qualification:-
Download product information
Overview
The MPC8241LZQ200D is an integrated processor featuring a 32-bit superscalar PowerPC MPC603E core operating at a maximum frequency of 200 MHz. It integrates a PCI bridge, memory controller supporting up to 2 GB of SDRAM, dual DMA controllers, and a message unit with I2O support. The device utilizes a 357-pin plastic ball grid array (PBGA) package and operates on a 1.8 V core supply voltage.
Feature Summary
- Integrates a high-performance PowerPC MPC603E core with floating-point capabilities and lockable L1 caches.
- Includes a 32-bit PCI interface compliant with PCI 2.2 standards and 5.0-V tolerance.
- Features a high-bandwidth memory controller supporting various SDRAM configurations and ECC protection.
- Provides integrated peripherals including dual UARTs, I2C controller, and programmable interrupt controller.
Applications
- Network infrastructure control processing
- Telecommunications systems
- Embedded computing applications
Procurement Notes
Verify component authenticity through official NXP Semiconductors channels or authorized distributors. Confirm the specific suffix LZQ corresponds to the required package type and temperature range. Check for any published errata or hardware specification updates relevant to revision 10 before finalizing procurement plans.
Selection Notes
Select this component when system design requires a highly integrated host processor with native PCI connectivity. Ensure the application supports the 1.8 V core voltage requirement and accommodates the thermal characteristics associated with the PBGA-357 package. Verify that software compatibility with the PowerPC architecture meets project needs.
Part Context
This part belongs to the MPC8241 family of integrated processors designed for embedded systems requiring significant peripheral integration. It serves as a cost-effective solution by reducing the number of discrete components needed for PCI-based architectures compared to earlier multi-chip solutions.
Replacement Considerations
Consult the official NXP product transition notices for valid substitute part numbers. Verify functional equivalence regarding pinout, voltage levels, and performance specifications before considering alternative devices from other manufacturers.
ChipApex | Global Electronic Components Supplier








