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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 352TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:I2C, I²O, PCI, UART
- Grade:-
- Qualification:-
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Overview
The MPC8245LVV266D is a PowerPC-based integrated microprocessor manufactured by NXP USA Inc. It features a 32-bit superscalar MPC603e processor core operating at a maximum frequency of 266 MHz. The device integrates a PCI bridge supporting up to 66 MHz, a high-performance memory controller for SDRAM, and various peripheral interfaces including I2C, I2O, and DUART. It utilizes a 352-pin Tape Ball Grid Array (TBGA) package with dimensions of 35x35 mm. The core operates within a voltage range of 1.7 V to 2.1 V, while the I/O supply is 3.3 V. The component supports an operating temperature range from 0°C to 105°C.
Feature Summary
- Integrates a high-performance 32-bit superscalar MPC603e processor core with floating-point support and dynamic power management capabilities.
- Includes a 32-bit PCI interface compatible with PCI 2.2 standards, featuring hardware-enforced coherency and agent mode capability.
- Provides a high-bandwidth memory controller supporting up to 2 Gbytes of SDRAM with ECC or parity options.
- Combines dual-channel DMA controllers, a programmable interrupt controller, and a message unit with I2O support.
Applications
- Network infrastructure systems such as routers and switches
- Telecommunications embedded applications
- Network storage solutions
- Image display systems
Procurement Notes
Verify the specific suffix LVV against official NXP documentation to confirm the exact package type and speed grade. Confirm RoHS compliance status and REACH registration details prior to integration. Check for product change notifications regarding end-of-life status, as this component may be discontinued. Ensure design compatibility with the required 352-pin TBGA footprint and thermal characteristics.
Selection Notes
Select this component for applications requiring a high-integration host processor with native PCI support. Consider the 266 MHz processing speed and available cache sizes for performance requirements. Evaluate the power consumption profiles across different operating modes if energy efficiency is critical. Ensure the system design accommodates the specific voltage sequencing and PLL configuration constraints defined in the hardware specifications.
Part Context
This part belongs to the MPC82xx family of PowerQuicc II processors designed for embedded systems. It builds upon the MPC603e core architecture to provide system-level support for industry-standard interfaces. The MPC8245 variant specifically targets cost-sensitive and space-constrained environments by integrating multiple discrete functions into a single chip.
Replacement Considerations
Public confirmed substitute part numbers are not provided in the source material. Consult NXP official documentation for current lifecycle status and potential obsolescence notices.
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