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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 352TBGA
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:I2C, I²O, PCI, UART
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Overview
The MPC8245LVV300D is a microprocessor from the MPC82xx series, manufactured by NXP USA Inc. It features a single-core PowerPC 603e processor with a 32-bit data bus width and operates at a speed of 300MHz. The device is housed in a 352-TBGA (35x35) package and supports surface mount installation. It includes an SDRAM controller and additional interfaces such as I2C, I²O, PCI, and UART. The operating temperature range is specified from 0°C to 105°C (TA), and it utilizes a 3.3V I/O voltage.
Feature Summary
- Integrates a high-performance PowerPC 603e superscalar processor core
- Supports up to 2 GB of SDRAM memory via a dedicated controller
- Includes a 32-bit PCI interface for system connectivity
- Features dual-channel DMA controllers for efficient data transfer
Applications
- Network infrastructure systems
- Telecommunications equipment
- Router and switch implementations
- Network storage applications
- Image display systems
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels due to end-of-life status. Confirm specific suffix variations against official datasheets to ensure correct pinout and electrical characteristics. Request original documentation for integration validation. Check RoHS compliance certificates if required for regulatory adherence. Validate package integrity upon receipt to prevent handling damage.
Selection Notes
Select this component for embedded applications requiring high integration and reduced system component costs. Consider its suitability for designs needing simplified circuit board layouts and lower power consumption. Evaluate compatibility with existing Power Architecture software ecosystems. Assess thermal management requirements for the TBGA package within the target operational temperature range.
Part Context
This part belongs to the MPC82xx family of integrated host processors designed for network infrastructure and telecommunications markets. It combines a powerful processor core with essential peripherals to support cost-sensitive and space-constrained applications. The series is known for enabling faster time-to-market through simplified design processes.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source material.
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