MPC8245LZU266D

Overview

The MPC8245LZU266D is a microprocessor from the MPC82xx family, utilizing the PowerPC 603e core architecture. It operates at a maximum frequency of 266 MHz and features a 32-bit data bus width with a single core configuration. The device supports an operating supply voltage range of 1.7V to 3.465V and functions within a commercial temperature range of 0°C to 105°C. It is housed in a 352-pin Thin Ball Grid Array (TBGA) package designed for surface mount applications.

Feature Summary

• Integrates a high-performance PowerPC 603e processor core with superscalar execution capabilities
• Includes a 32-bit PCI interface supporting operation up to 66 MHz
• Features integrated memory controllers supporting SDRAM and DRAM technologies
• Provides multiple peripheral interfaces including I2C, UART, and DMA controllers

Applications

• Network infrastructure systems such as routers and switches
• Telecommunications equipment requiring embedded processing
• Network storage applications and image display systems
• Enterprise I/O processors and internet access devices

Procurement Notes

Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity and pin alignment prior to assembly. Review latest hardware specifications for any design-in updates or errata that may impact system integration. Ensure compliance with RoHS directives if required by target market regulations.

Selection Notes

Select this component for applications demanding high integration and reduced system component costs. Consider the 352-pin TBGA package constraints during PCB layout planning. Evaluate thermal management requirements given the commercial temperature range limits. Verify software compatibility with existing PowerPC development tools and operating environments.

Part Context

This part belongs to the MPC82xx series of integrated host processors designed for network and telecommunications markets. It combines a powerful processor core with essential peripherals on a single chip to simplify board design and lower power consumption compared to discrete solutions.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official NXP resources for potential obsolescence management strategies or alternative product recommendations.