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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 352TBGA
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:I2C, I²O, PCI, UART
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Overview
The MPC8245LZU300D is a microprocessor from the PowerQUICC III family, utilizing the PowerPC 603e core architecture. It features a single 32-bit processing core operating at a maximum clock frequency of 300 MHz. The device integrates a 16 kB instruction cache and a 16 kB data cache within its Level 1 memory structure. It supports SDRAM interfaces with frequencies up to 133 MHz and includes a 32-bit PCI interface capable of running at speeds up to 66 MHz. The processor operates on a core voltage range of 1.9 V to 2.2 V with 3.3 V I/O levels, housed in a 352-ball TBGA package.
Feature Summary
- Integrates a high-performance PowerPC 603e superscalar processor core with floating-point capabilities
- Includes a dedicated 32-bit PCI controller supporting standard bus mastering and locking mechanisms
- Features a flexible memory controller supporting high-bandwidth SDRAM and DRAM configurations
- Provides integrated communication peripherals including dual UARTs and I2C interfaces
Applications
- Network infrastructure equipment such as routers and switches
- Enterprise input/output processors
- Internet access devices (IAD)
- Image display systems
Procurement Notes
Verify component authenticity through authorized NXP Semiconductors channels due to potential availability constraints. Confirm RoHS compliance status for specific manufacturing lots, as historical production runs may vary. Ensure proper handling procedures are followed given the moisture sensitivity classification associated with the BGA packaging type. Validate that the specific suffix matches the required clock speed and package variant for the target design implementation.
Selection Notes
Select this component when a robust RISC processor with integrated PCI connectivity is required for embedded networking tasks. Consider the 603e core compatibility if existing software libraries are optimized for Power Architecture. Evaluate the 300 MHz performance against system throughput requirements. Ensure the 352-ball TBGA package fits the available PCB real estate and thermal management strategy for the intended application environment.
Part Context
This part belongs to the MPC8245 series within the PowerQUICC III product line, designed for cost-sensitive and space-constrained network applications. It serves as an integrated host processor combining CPU, memory controller, and peripheral functions. The series targets telecommunications and embedded markets requiring reliable processing with reduced system component counts compared to discrete solutions.
Replacement Considerations
Consult official documentation for direct pin-compatible alternatives within the MPC82xx family. Verify functional equivalence regarding the 603e core and PCI interface specifications before substitution.
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