— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 352TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:I2C, I²O, PCI, UART
- Grade:-
- Qualification:-
Download product information
Overview
The MPC8245TVV266D is a PowerPC-based microprocessor featuring the MPC603e core, operating at a maximum frequency of 266 MHz. It integrates a PCI bridge and supports an extended temperature range from -40°C to 105°C. The device utilizes a lead-free TBGA package (VV) and requires a core voltage between 1.7 V and 2.1 V. This part number designates a pilot production prototype with preliminary reliability data.
Feature Summary
- Integrates a high-performance PowerPC MPC603e processor core with a dedicated PCI bridge for system connectivity.
- Supports extended industrial temperature operation ranging from -40°C to 105°C.
- Features a lead-free TBGA package construction suitable for surface mount applications.
Applications
- Network infrastructure systems
- Telecommunications equipment
- Embedded systems requiring integrated PCI interfaces
Procurement Notes
Verify that the component is accepted as a pilot production prototype, as indicated by the 'T' prefix in the part number. Ensure written authorization acknowledging qualification status is on file before shipment. Confirm that the lead-free TBGA package corresponds to part revision D. Validate all operating parameters against specific customer application requirements.
Selection Notes
Select this component when an extended temperature range (-40°C to 105°C) is required alongside a 266 MHz processing speed. The integrated PCI bridge reduces system component count. Note that the VV package indicates lead-free construction available only in revision D. Verify compatibility with existing software environments built for Power Architecture processors.
Part Context
This part belongs to the MPC8245 series, which combines a PowerPC MPC603e core with a PCI bridge. The MPC8245 is designed for cost-sensitive, space-constrained applications in network infrastructure and embedded markets. The specific TVV suffix denotes the extended temperature range and lead-free TBGA packaging configuration.
Replacement Considerations
MPC8245TZU266D
ChipApex | Global Electronic Components Supplier






