MPC8245TVV300D-NXP

Overview

The MPC8245TVV300D-NXP is a 32-bit Power Architecture microprocessor operating at 300MHz. It features an integrated host processor with PCI interface capabilities and supports an extended industrial temperature range of -40°C to 105°C. The component utilizes a 352-ball TBGA package measuring 35x35mm, designed for surface mount applications in embedded systems requiring robust processing power.

Feature Summary

• Integrates a 32-bit RISC core based on the PowerPC architecture for efficient instruction execution
• Includes built-in PCI interface functionality for high-speed peripheral connectivity
• Operates reliably across extended industrial temperature ranges suitable for harsh environments

Applications

• Industrial control systems requiring robust processing
• Embedded networking equipment with PCI bus requirements
• Automotive electronics operating in extreme temperatures

Procurement Notes

Verify the specific suffix 'NXP' against official NXP documentation to confirm it denotes a valid manufacturer designation or distributor-specific marking rather than a functional variant. Ensure the 352-TBGA package dimensions match your PCB footprint exactly. Confirm the extended temperature grade (-40°C to 105°C) aligns with your thermal design specifications before finalizing procurement.

Selection Notes

Select this component when a 32-bit Power Architecture solution with native PCI support is required. The 300MHz clock speed offers sufficient throughput for moderate-complexity embedded tasks. Consider the 352-ball BGA package constraints during layout planning. Verify that the operating voltage and power consumption profiles fit within your system's thermal and electrical budget constraints.

Part Context

This part belongs to the MPC82xx family of microprocessors from NXP Semiconductors (formerly Freescale). These processors are designed for communication and industrial applications, leveraging the PowerPC 603e core architecture. The series is known for integrating memory controllers and peripheral interfaces directly onto the die to reduce system complexity.

Replacement Considerations

Consult NXP official cross-reference guides for direct replacements. Potential alternatives may include other members of the MPC82xx series with compatible pinouts or higher clock speeds, provided software compatibility with the PowerPC 603e architecture is maintained.