— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 352TBGA
- Series:MPC82xx
- Mfr:NXP Semiconductors
- Package:Bulk
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA Exposed Pad
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:DMA, DUART, I2C, I²O, PCI, UART
- Grade:-
- Qualification:-
Download product information
Overview
The MPC8245TZU300D is a 32-bit Integrated Host Processor based on the Power Architecture, manufactured by NXP Semiconductors. It operates at a clock speed of 300 MHz and utilizes the PowerPC 603e core. The component is housed in a 352-ball Thin Ball Grid Array (TBGA) package. It features an integrated PCI interface to support high-performance data transfer requirements. The device is designed for applications where cost, space, power consumption, and performance are critical constraints.
Feature Summary
- Integrates a 32-bit Power Architecture processor with an embedded PCI controller
- Utilizes the PowerPC 603e core architecture for efficient processing
- Provides a compact 352-ball TBGA package solution
Applications
- Network infrastructure equipment
- Industrial control systems
- Embedded computing platforms requiring integrated connectivity
Procurement Notes
Verify the specific suffix 'TZU300D' against official NXP documentation to confirm the 300 MHz frequency and TBGA-352 package configuration. Ensure the operating temperature range matches project requirements, as variants exist for different thermal environments. Cross-reference part numbers carefully to distinguish between similar MPC82xx series components with differing speeds or packages.
Selection Notes
Select this component when a balance of processing power and integrated peripheral connectivity is required within a constrained physical footprint. The integrated PCI interface reduces external component count compared to solutions requiring separate bridge controllers. Consider the 300 MHz operational speed relative to system latency requirements and ensure the TBGA-352 package is compatible with the target PCB design capabilities.
Part Context
This part belongs to the MPC82xx family of Integrated Host Processors from NXP Semiconductors. These processors are engineered for network and communication applications. The MPC8245 variant specifically targets scenarios demanding robust processing capabilities alongside direct peripheral integration, distinguishing it from general-purpose microcontrollers by its focus on host-level data handling and bus management.
Replacement Considerations
Consult NXP documentation for direct substitutes such as the MPC8245ARZU400D or MPC8245LVV266D, which offer different clock speeds or temperature ranges. Verify pin compatibility and electrical specifications before substitution, as performance characteristics vary across the MPC8245 product line.
ChipApex | Global Electronic Components Supplier








