— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 200MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:200MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8250ACVRIHBC is a PowerQUICC II communications processor featuring a dual-issue EC603e core operating at 200 MHz. It integrates a high-performance Communication Processor Module (CPM) with an embedded 32-bit RISC microcontroller and 32 Kbytes of dual-port RAM. The device includes a 60x-to-PCI bridge, three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), one Multichannel Controller (MCC2), and four TDM interfaces. It utilizes a 516-pin PBGA package.
Feature Summary
- Dual-issue integer core with separate 16-Kbyte data and instruction caches
- Integrated Communication Processor Module for flexible protocol support
- Dedicated PCI bus interface supporting up to 66 MHz operation
- Multiple serial communication controllers including FCC, SCC, SMC, and TDM
Applications
- Network routers and switches
- Base station controllers
- Industrial gateways
- Multi-service access platforms
Procurement Notes
Verify the specific suffix 'IHBC' against official NXP documentation to confirm pinout and package details. Confirm RoHS compliance status as the component may be subject to end-of-life notices. Ensure compatibility with existing board designs regarding voltage levels and thermal requirements before procurement.
Selection Notes
Select this processor for applications requiring high-speed packet processing and extensive serial connectivity. Evaluate the need for the CPM's dedicated processing capabilities versus the main G2 core. Consider the 516-pin PBGA package constraints during PCB layout and ensure adequate cooling solutions are available for the specified power dissipation profiles.
Part Context
This component belongs to the MPC82xx series of PowerQUICC II processors designed by Freescale Semiconductor, now NXP Semiconductors. These devices were engineered for telecommunications infrastructure, offering a balance of processing power and integrated peripheral interfaces suitable for complex networking tasks.
Replacement Considerations
The MPC8250ACVRIHBC is footprint-compatible with the MPC8260. However, verify electrical characteristics and feature sets carefully. No direct public substitute part numbers are confirmed in the provided documentation.
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