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Product Detailed Parameters
- Description:IC MPU MPC82XX 266MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8250ACZUMHBC is a PowerQUICC II microprocessor based on the EC603e core, operating at frequencies up to 200 MHz. It features a dual-issue integer architecture with separate 16-Kbyte instruction and data caches. The device includes a Communications Processor Module (CPM) for protocol handling, a 60x-to-PCI bridge, and multiple serial controllers including Ethernet, HDLC, UART, and TDM interfaces. It utilizes a 480-pin TBGA package and operates with a 1.8 V core supply and 3.3 V I/O voltage.
Feature Summary
- Dual-issue EC603e core with floating-point unit and separate L1 caches
- Integrated Communications Processor Module supporting Ethernet, HDLC, and TDM protocols
- 60x-to-PCI bridge with DMA capabilities and hot-swap support
- Separate PLLs allowing independent frequency optimization for core and CPM
Applications
- Network routers and switches
- Base station controllers
- Industrial communication gateways
- Multi-service access platforms
Procurement Notes
Verify the specific suffix ZUMHBC against official NXP documentation to confirm package type and temperature range. Confirm RoHS compliance status as historical data may vary. Check for obsolescence notices or lifecycle changes from NXP Semiconductors before procurement planning.
Selection Notes
Select this component for applications requiring high-performance communications processing with integrated PCI connectivity. Ensure design supports the required 1.8 V core and 3.3 V I/O power domains. Verify that the system clock configuration meets the specified multiplier ratios for the target operating frequency.
Part Context
This part belongs to the MPC82xx series of PowerQUICC II processors designed by Freescale Semiconductor, now NXP. These devices were widely used in embedded networking equipment during the early 2000s. The MPC8250 specifically targets cost-sensitive applications compared to higher-end models like the MPC8260 while maintaining significant integration.
Replacement Considerations
The MPC8260 is footprint-compatible but requires verification of electrical differences. No direct public substitute part numbers are confirmed for this specific legacy component.
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